laptop ic list
Abstract: NS6040 contactor Amkor Technology handler
Text: data sheet TEST CONTACTOR FusionQuad Test Contactor Test Hardware List: Amkor FusionQuad® Test Contactor: Amkor Technology is now offering the FusionQuad® Test Contactor Amkor’s FusionQuad® represents a breakthrough in leadframe-based plastic packaging through the effective
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NS6040
DS815B
laptop ic list
contactor
Amkor Technology
handler
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amkor
Abstract: amkor exposed pad
Text: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a
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amkor exposed pad
Abstract: exposed QFP 128 amkor exposed QFP 144
Text: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses
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DUAL ROW QFN leadframe
Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This
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MEMS blood pressure sensor
Abstract: "Blood Pressure Sensor" MEMS pressure sensor silicon mems microphone capacitor mems gas sensor mems microphone mems amkor microphone MEMS Filter MEMS optical tunable filters
Text: solution microelectromechanical systems technology MEMS Technology Microelectromechanical systems MEMS are micron-size devices that can sense or manipulate the physical world. MEMS are created using micro machining processes, similar to those used to produce integrated
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ISO-9002,
ISO-9001,
QS-9000
ISO-9001
TS-16949,
MEMS blood pressure sensor
"Blood Pressure Sensor"
MEMS pressure sensor
silicon mems microphone
capacitor mems gas sensor
mems microphone
mems
amkor microphone
MEMS Filter
MEMS optical tunable filters
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copper wire datasheet
Abstract: copper wire 1mm Amkor Technology ATP3 ATP1 au wire copper bond wire copper bond wire amkor
Text: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.
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22V10A
Abstract: LVCMOS33 LVCMOS18 QFN PACKAGE thermal resistance LVCMOS25 QFN footprint amkor mlf qfn
Text: Using the ispGAL22V10A in the QFN Package April 2003 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is
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ispGAL22V10A
AN8074
22V10A
22V10
sizCMOS25
LVCMOS18
ispGAL22V10A
1800adapter
1-800-LATTICE
LVCMOS33
QFN PACKAGE thermal resistance
LVCMOS25
QFN footprint
amkor mlf qfn
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22V10
Abstract: 22V10A LVCMOS25 LVCMOS33 ABEL plastron
Text: Using the ispGAL22V10A in the QFN Package November 2007 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is
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ispGAL22V10A
AN8074
22V10A
22V10
1800adapter
1-800-LATTICE
22V10
LVCMOS25
LVCMOS33
ABEL
plastron
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HCP0703
Abstract: B230A RLF7030-1R0 SSA23L
Text: MIC4782 Evaluation Board Dual 2A Buck Regulator General Description The Micrel MIC4782 is a high efficiency dual PWM buck step-down regulator that provides up to 2A of output current for each channel. The MIC4782 operates at 1.8MHz and has proprietary internal compensation that
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MIC4782
200kHz.
MIC4782
M9999-120209-A
HCP0703
B230A
RLF7030-1R0
SSA23L
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CS-007
Abstract: Amkor Electronics Amkor mold compound
Text: LEADFRAME data sheet FusionQuad Body Exposed Pad Size mm Size (mm) 176 ld 14 x 14 6.5 x 6.5 A Electrical: Theta JA (°C/W) by Velocity (m/s) 1.0 2.5 24.6 19.9 17.9 Body Pad Size Size Pkg (mm) 14 x 14 Inductance Capacitance Resistance (mm) Lead 6.5 x 6.5 176 ld
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L512 led
Abstract: Adjustable Current Regulator With Enable Control
Text: MIC2210 Micrel MIC2210 Dual µCap LDO with Open-Drain Driver Final General Description Features The MIC2210 is a dual µCap low dropout regulator with an open-drain driver and power-on reset circuit. The first regulator is capable of sourcing 150mA, while the second regulator can source up to 300mA and includes a power-on reset
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MIC2210
MIC2210
150mA,
300mA
150mA
100mA)
L512 led
Adjustable Current Regulator With Enable Control
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CY7C65630
Abstract: CY4602A CY4602 CY4605 CY7C65620 CY7C65640A CY7C656XX usb esd eye pattern
Text: Application Note AN5044 CY7C656xx PCB Design Recommendations Author: Keith Klepin Associated Project: No Associated Part Family: CY7C65620/30 Software Version: N/A Associated Application Notes: None Abstract This application note presents recommendations for designing with the Cypress Semiconductor CY7C65640A, CY7C65630,
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AN5044
CY7C656xx
CY7C65620/30
CY7C65640A,
CY7C65630,
CY7C65620
AN5044
CY7C65630
CY4602A
CY4602
CY4605
CY7C65640A
usb esd eye pattern
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PIC16F73
Abstract: PIC16C73B PIC16C72A AC164031 PIC16F76
Text: PICmicro Microcontrollers in Small-Scale MLF Packages Ideal For Applications Where Space is Vital Microchip Technology Inc. is producing a number of the company’s popular PICmicro® OTP and Flash microcontrollers in a new competitively-priced, space-saving MicroLeadframe MLF package.
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directC16F73;
PIC16F76.
20-lead
40-lead
PIC16F73
PIC16C73B
PIC16C72A
AC164031
PIC16F76
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CY4602
Abstract: physical layer design for USB 2.0 USB 2.0 HUB CY7C65630 "4 port" passive hub magic eye schematic diagram 48v dc motor speed controller usb common mode choke CY7C65620 CY7C65640A
Text: Application Note AN5044 CY7C656xx PCB Design Recommendations Author: Keith Klepin Associated Project: No Associated Part Family: CY7C65620/30 Software Version: N/A Associated Application Notes: None Abstract This application note presents recommendations for designing with the Cypress Semiconductor CY7C65640A, CY7C65630,
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AN5044
CY7C656xx
CY7C65620/30
CY7C65640A,
CY7C65630,
CY7C65620
AN5044
CY4602
physical layer design for USB 2.0
USB 2.0 HUB
CY7C65630
"4 port" passive hub
magic eye
schematic diagram 48v dc motor speed controller
usb common mode choke
CY7C65640A
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Untitled
Abstract: No abstract text available
Text: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.
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40mil
55/60nm
45/40nm
28/22nm
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CY7C65630
Abstract: CY7C65620 CY4602 CY4605 CY7C65640A CY7C656XX
Text: Application Note AN5044 CY7C656xx PCB Design Recommendations - AN5044 Author: Keith Klepin Associated Project: No Associated Part Family: CY7C65620/30 Software Version: N/A Associated Application Notes: None Abstract This application note presents recommendations for designing with the Cypress Semiconductor CY7C65640A, CY7C65630,
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AN5044
CY7C656xx
CY7C65620/30
CY7C65640A,
CY7C65630,
CY7C65620
CY7C65630
CY4602
CY4605
CY7C65640A
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MIC2214
Abstract: No abstract text available
Text: Complete Portable Power Management Solution in Tiny MLF Package! 1/ THE SIZE OF THE 3 CURRENT SOLUTION! MIC2214 Baseband PMIC in MLF Actual Size Thickness: SC-70 SOT-23 0.95mm 1.3mm MLF 3mm x 3mm 0.85mm The Good Stuff ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆
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MIC2214
SC-70
OT-23
150mA
300mA
120mV
MIC2214
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CY7C65630
Abstract: CY4602 CY4605 CY7C65620 CY7C65640A CY7C656XX
Text: EZ-USB Hubs CY7C656XX PCB Design Recommendations AN5044 Author: Keith Klepin Associated Project: No Associated Part Family: CY7C65620/CY7C65630/CY7C65640A Software Version: None Associated Application Notes: None Application Note Abstract AN5044 presents recommendations for designing with the Cypress Semiconductor CY7C65640A, CY7C65630, and
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CY7C656XX)
AN5044
CY7C65620/CY7C65630/CY7C65640A
AN5044
CY7C65640A,
CY7C65630,
CY7C65620
CY7C65630
CY4602
CY4605
CY7C65640A
CY7C656XX
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microleadframe amkor
Abstract: TM0011
Text: ᆅগॐࠓႊೌपހጎ LFCSP ยऺᇑሰኸళ ፕኁǖGary Griffin ణ ० ० . 1 ӱยऺ୯ . 2
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MO220
MO229
EM-2000-011)
737mm
TM-00-11)
AN05425-0-2/06
microleadframe amkor
TM0011
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Amkor Technology MLF
Abstract: MIC2288 MIC2289 MIC2290 MIC2292 MIC2293 "White LED Drivers"
Text: Power and System Management for Battery Powered Applications Organic Boost Regulators 2mm x 2mm MLF TM VIN OFF ON VIN VOUT 2" OEL PANEL OFF • >1A Switch Current MIC2288 • 1.2MHz PWM Operation 1" OEL PANEL MIC 2290 ON • >500mA Switch Current (MIC2290)
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MIC2288)
500mA
MIC2290)
600mA
150mA
/300mA
Amkor Technology MLF
MIC2288
MIC2289
MIC2290
MIC2292
MIC2293
"White LED Drivers"
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Untitled
Abstract: No abstract text available
Text: MIC5166 3A High-Speed Low VIN DDR Terminator Benefits Features • 3mm x 3mm MLF package • Tiny size allows closer placement to DDR memory • High-side NMOS output stage offers very low impedance and very high bandwidth • Stable with two 10 uF ceramic output capacitors
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MIC5166
MIC5166-021813
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Untitled
Abstract: No abstract text available
Text: SY84402L Product Brief 4.25Gbps VCSEL Driver Description The SY84402L is a 3.3V VCSEL driver for applications up to 4.25Gbps. The driver comes in a 2mm x 2mm MLF package which makes it less than half the size of any other driver operating at that rate. The variable output swing on
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SY84402L
25Gbps
SY84402L
25Gbps.
MIC300X,
M9999-102909
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Untitled
Abstract: No abstract text available
Text: SY89251V Product Brief Enhanced Differential Receiver Description The SY89251V is a differential PECL/ECL receiver/buffer in a space saving 2mm x 2mm MLF package. The device is functionally equivalent to the SY100EL16VC, except for an active HIGH enable pin and a 70% smaller
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SY89251V
SY89251V
SY100EL16VC,
SY89250V,
SE-171
M9999-0333109
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