amkor CABGA 56
Abstract: chiparray amkor CABGA 8X8 CTBGA CABGA 17 x 17 thermal resistance CABGA CVBGA MO-195 8x8 64 footprint amkor cabga
Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: Amkor’s ChipArray® packages are laminatebased Ball Grid Array BGA packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count,
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Untitled
Abstract: No abstract text available
Text: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.
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40mil
55/60nm
45/40nm
28/22nm
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E700G
Abstract: No abstract text available
Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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DS577G
E700G
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A2E5
Abstract: No abstract text available
Text: LH7A404 32-Bit System-on-Chip Data Sheet FEATURES • Three Programmable Timers • 32-bit ARM9TDMI RISC Core – 16KB Cache: 8KB Instruction and 8KB Data Cache – MMU Windows CE™ Enabled – Up to 266 MHz; See Table 1 for speed/temp options • Three UARTs, one with Classic IrDA (115 kbit/s)
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LH7A404
32-bit
10-bit
SMA02004
A2E5
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amkor CABGA 56
Abstract: lpp 68 g1
Text: LH7A404 32-Bit System-on-Chip Data Sheet FEATURES • Three Programmable Timers • 32-bit ARM9TDMI RISC Core – 16KB Cache: 8KB Instruction and 8KB Data Cache – MMU Windows CE™ Enabled – Up to 266 MHz; See Table 1 for speed/temp options • Three UARTs, one with Classic IrDA (115 kbit/s)
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LH7A404
32-bit
10-bit
SMA02004
amkor CABGA 56
lpp 68 g1
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TSMC 0.18 um MOSfet
Abstract: M38510 10102BCA IDT7204L 5962-8768401MQA 0.18um LDMOS TSMC sl1053 TSMC 0.25Um LDMOS UT63M125BB SMD RTAX250S-CQ208 5962-04221
Text: DSCC Supplemental Information Sheet for Electronic QML-38535 Specification Details: Date: 9/2/2008 Specification: MIL-PRF-38535 Title: Advanced Microcircuits Federal Supply Class FSC : 5962 Conventional: No Specification contains quality assurance program: Yes
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QML-38535
MIL-PRF-38535
MIL-STD-790
MIL-STD-690
-581DSCC
QML-38535
TSMC 0.18 um MOSfet
M38510 10102BCA
IDT7204L
5962-8768401MQA
0.18um LDMOS TSMC
sl1053
TSMC 0.25Um LDMOS
UT63M125BB SMD
RTAX250S-CQ208
5962-04221
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