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    AMD 28 PDIP PACKAGE DIMENSIONS Search Results

    AMD 28 PDIP PACKAGE DIMENSIONS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    AMD 28 PDIP PACKAGE DIMENSIONS Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    PLCC 32 intel package dimensions

    Abstract: 845 bios chip intel 845 circuit diagram all chip TSOP 48 thermal resistance TSOP 48 LAYOUT ap623 am 28f040 AP-623 PCB Layout tsop 48 PIN SOCKET
    Text: E AP-623 APPLICATION NOTE Multi-Site Layout Planning with Intel’s Boot Block Flash Memory December 1996 Order Number: 292178-003 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		AP-623 AP-607 AB-57 AB-60 PLCC 32 intel package dimensions 845 bios chip intel 845 circuit diagram all chip TSOP 48 thermal resistance TSOP 48 LAYOUT ap623 am 28f040 AP-623 PCB Layout tsop 48 PIN SOCKET PDF

    footprint jedec MS-026 TQFP

    Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
    Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES


    Original     		PDF

    isl95836

    Abstract: ISL95520 ISL95833 ISL95835 VR126 isl6262 IRS 4 Channel Integrated Class D Audio Driver IC with PWM Modulator ISL912 0/VR126 ISL91106
    Text: P WERING CONSUMER ELECTRONICS Tablets, Smartphones, Smart Watch, Notebook Computers P WERING CONSUMER The power management requirements of efficiency and power dense solutions that mobile devices are becoming more complex increase the battery life of devices and systems


    Original     		LC-114 isl95836 ISL95520 ISL95833 ISL95835 VR126 isl6262 IRS 4 Channel Integrated Class D Audio Driver IC with PWM Modulator ISL912 0/VR126 ISL91106 PDF

    diode A14A

    Abstract: BIOS 32 Pin PLCC 845 bios chip PLCC 32 intel package dimensions amd 29f040 thermal resistance INTEL FLASH MEMORY DATA SHEET transistor ap 431 tsop 28-LEAD Footprints picture in picture chip psop 1
    Text: E AP-623 APPLICATION NOTE Multi-Site Layout Planning with Intel's Boot Block Flash Memory CHARLES ANYIMI SENIOR TECHNICAL MARKETING ENGINEER December 1995 Order Number: 292178-002 Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including


    Original     		AP-623 AP-607, AB-57, AB-60, diode A14A BIOS 32 Pin PLCC 845 bios chip PLCC 32 intel package dimensions amd 29f040 thermal resistance INTEL FLASH MEMORY DATA SHEET transistor ap 431 tsop 28-LEAD Footprints picture in picture chip psop 1 PDF

    AM27X256

    Abstract: No abstract text available
    Text: FINAL Am27X256 256 Kilobit 32 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation


    Original     		Am27X256 16-038FPO-5 AM27X256 PDF

    AM27X512

    Abstract: No abstract text available
    Text: FINAL Am27X512 512 Kilobit 64 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation


    Original     		Am27X512 16-038FPO-5 AM27X512 PDF

    AM27X128

    Abstract: No abstract text available
    Text: FINAL Am27X128 128 Kilobit 16 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation


    Original     		Am27X128 16-038FPO-5 AM27X128 PDF

    AM27X64

    Abstract: No abstract text available
    Text: FINAL Am27X64 64 Kilobit 8 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation


    Original     		Am27X64 16-038FPO-5 AM27X64 PDF

    16-038-SB-AG

    Abstract: AM27X040
    Text: FINAL Am27X040 4 Megabit 512 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation


    Original     		Am27X040 AM27X040 16-038-SB-AG PDF

    AM27X020

    Abstract: No abstract text available
    Text: FINAL Am27X020 2 Megabit 256 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: ■ High noise immunity ■ Low power dissipation — Factory optimized programming — Fully tested and guaranteed


    Original     		Am27X020 AM27X020 PDF

    Untitled

    Abstract: No abstract text available
    Text: FINAL Am27X1024 1 Megabit 64 K x 16-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation


    Original     		Am27X1024 16-Bit) 16-038-SQ AM27X1024 PDF

    AM27X020

    Abstract: No abstract text available
    Text: FINAL Am27X020 2 Megabit 256 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation


    Original     		Am27X020 16-038FPO-5 AM27X020 PDF

    Untitled

    Abstract: No abstract text available
    Text: FINAL Am27X2048 2 Megabit 128 K x 16-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation


    Original     		Am27X2048 16-Bit) 16-038-SQ AM27X2048 PDF

    AM27X010

    Abstract: DA79
    Text: FINAL Am27X010 1 Megabit 128 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance ■ As an OTP EPROM alternative: — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation


    Original     		Am27X010 28-Pin 32-Pin Am27X010-55 DA79 PDF

    IN3064

    Abstract: am29f010b-55
    Text: Am29F010B Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both Advanced Micro Devices and Fujitsu. Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and


    Original     		Am29F010B IN3064 am29f010b-55 PDF

    tsop Shipping Trays

    Abstract: No abstract text available
    Text: Section 4 Thin Sm all O utline P a c k a g e T H IN SMALL O U TLIN E PACKAGE TSO P DES C R IP TIO N AMD presents the Thin Small Outline Package. The TSOP is the industry’s leading edge plastic, surface mountable memory package today. System requirements for higher den­


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: AMD3 Am27X256 256 Kilobit 32 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • As an OTP EPROM alternative: — Factory optimized programming — Fully tested and guaranteed ■ As a Mask ROM alternative: — Shorter leadtime — Lower volume per code


    OCR Scan     		Am27X256 16-038-SB-AG 032--32-Pin 16-038FP0-5 PDF

    Untitled

    Abstract: No abstract text available
    Text: AMD3 Am27C512 512 Kilobit 64 K X 8-Bit CMOS EPRO DISTINCTIVE CHARACTERISTICS • Fast access time ■ Latch-up protected to 100 mA from -1 V to Vcc +1 V ■ High noise immunity ■ Versatile features for simple interfacing — Speed options as fast as 55 ns


    OCR Scan     		Am27C512 28-pin 32-pin 512-Kbit, PDF

    amd 27C2048

    Abstract: am27c2048 27C2048
    Text: F IN A L A M D il Am27C2048 2 Megabit 128 K x 16-Bit CMOS EPROM DISTINCTIVE CHARACTERISTICS • ±10% power supply tolerance standard ■ Fast access time ■ 100% Flashrite programming — Speed options as fast as 55 ns — Typical programming time of 16 seconds


    OCR Scan     		Am27C2048 16-Bit) 40-pin 44-pin 27C2048 044--44-Pin 16-038-SQ amd 27C2048 27C2048 PDF

    amd 28 pdip package dimensions

    Abstract: No abstract text available
    Text: A A m 2 7 X 1 M D Z I 1 Megabit 128 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • As an OTP EPROM alternative: ■ ±10% power supply tolerance — Factory optimized programming ■ High noise immunity — Fully tested and guaranteed ■ Low power dissipation


    OCR Scan     		28-Pin 32-Pin Am27X010-55 Am27X010 amd 28 pdip package dimensions PDF

    Untitled

    Abstract: No abstract text available
    Text: FINAL A M D il Am27C010 1 Megabit 128 K x 8-Bit CMOS EPROM DISTINCTIVE CHARACTERISTICS • 100% Flashrite programming ■ Fast access time — Speed options as fast as 45 ns — Typical programming time of 16 seconds ■ Low power consumption ■ Latch-up protected to 100 mA from -1 V to


    OCR Scan     		Am27C010 32-pin AM27C010-45, 27C010 PDF

    Untitled

    Abstract: No abstract text available
    Text: FINAL AMD£I Am27X040 4 Megabit 512 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • As an OTP EPROM alternative: ■ ±10% power supply tolerance — Factory optim ized program m ing ■ High noise immunity — Fully tested and guaranteed


    OCR Scan     		Am27X040 PDF

    Untitled

    Abstract: No abstract text available
    Text: AM D a Am27X2048 2 Megabit 128 K x 16-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • -10% power supply tolerance ■ High noise immunity ■ Low power dissipation ■ As an OTP EPROM alternative: — Factory optimized programming — F'jliy tested and guaranteed


    OCR Scan     		Am27X2048 16-Bit) PDF

    Untitled

    Abstract: No abstract text available
    Text: AMD£I F IN A L Am27X010 1 Megabit 128 K x 8-Bit CMOS ExpressROM Device DISTINCTIVE CHARACTERISTICS • As an OTP EPROM alternative: ■ +10% power supply tolerance — Factory optim ized programming ■ High noise immunity — Fully tested and guaranteed


    OCR Scan     		Am27X010 28-Pin 32-Pin 27X010-55. PDF