Fabrication process steps metal core pcb
Abstract: led mcpcb large copper trace thermal Fabrication process steps mcpcb AL 5052 luxeon 1w fabrication of mcpcb fr4 metal slug Aluminum Base LED PCB FR4 Prepreg 390DH4
Text: AB10 LuxeonTM Emitter Assembly Information Application Brief Table of Contents • Introduction · Important Design Rules · Metal Core Printed Circuit Board MCPCB · Supply Chain and MCPCB Specification · MCPCB Design Guidelines · Process Flow to Build
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95Sn5Sb
Abstract: HP 3478A Copper Alloy C151 bts 2140 AN1907 C101 C102 C151 SAC305 ausi die attach
Text: Freescale Semiconductor Application Note AN1907 Rev. 3, 5/2009 Solder Reflow Attach Method for High Power RF Devices in Over - Molded Plastic Packages By: Keith Nelson, Quan Li, Lu Li, and Mahesh Shah INTRODUCTION TERMINOLOGY DEFINITIONS The purpose of this application note is to provide
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AN1907
95Sn5Sb
HP 3478A
Copper Alloy C151
bts 2140
AN1907
C101
C102
C151
SAC305
ausi die attach
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TRANSISTOR CW 7805
Abstract: AN3789 SAC305 laser soldering CELSTRAN CW 7805 MRF6V2300N pa66 fr PA66-GF60 sac305 thermal conductive 270WB
Text: Freescale Semiconductor Application Note AN3789 Rev. 0, 3/2009 Clamping of High Power RF Transistors and RFICs in Over - Molded Plastic Packages By: Mahesh Shah, Richard Rowan, Lu Li, Quan Li, Eddie Mares, and Leonard Pelletier INTRODUCTION This application note provides Freescale Semiconductor
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AN3789
TRANSISTOR CW 7805
AN3789
SAC305 laser soldering
CELSTRAN
CW 7805
MRF6V2300N
pa66 fr
PA66-GF60
sac305 thermal conductive
270WB
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PPS GF60
Abstract: bts 2140 1b data sheet CELSTRAN cw 7805 MRF6V2300 AN3789 TRANSISTOR CW 7805 pa66 - fr pcb bts 2140 pa66 fr
Text: Freescale Semiconductor Application Note AN3789 Rev. 0, 3/2009 Clamping of High Power RF Transistors and RFICs in Over - Molded Plastic Packages By: Mahesh Shah, Richard Rowan, Lu Li, Quan Li, Eddie Mares, and Leonard Pelletier INTRODUCTION This application note provides Freescale Semiconductor
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AN3789
PPS GF60
bts 2140 1b data sheet
CELSTRAN
cw 7805
MRF6V2300
AN3789
TRANSISTOR CW 7805
pa66 - fr pcb
bts 2140
pa66 fr
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Untitled
Abstract: No abstract text available
Text: flow 90Z package with wire pins copyright Vincotech Handling Instruction for Flow 90Z packages It is valid for all type of Flow90Z modules. Handling Instruction 01 Initial release 29.04.2014 Zs. Gyimothy T. Pribéli Ver Alteration Date Des. / Mod. Appr. Flow90Z-P-*-HI
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Flow90Z
Flow90Z-P-
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Melcor peltier
Abstract: peltier melcor Peltier element Melcor thermo peltier Melcor footprint soic28 Melcor peltier 40 peltier peltier cooler peltier application notes
Text: MEASURING THE EFFECTS OF ENERGY FLOW ON IC PACKAGE THERMAL PERFORMANCE APPLICATION NOTE AN-160 Integrated Device Technology, Inc. By Chris Wyland ABSTRACT Heat to Air This paper is an examination of how to model PCB conduction effects when modeling IC package thermal performance.
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AN-160
EIA/JESD51-1
MRL-92-TIR-2
EIA/JESD51-3
Melcor peltier
peltier melcor
Peltier element
Melcor thermo peltier
Melcor
footprint soic28
Melcor peltier 40
peltier
peltier cooler
peltier application notes
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lelon capacitor
Abstract: LELON electrolytic capacitor lelon rzd lelon electrolytic capacitor vent type vent capacitor LELON capacitor reflow soldering lelon 470 electrolytic capacitor 470 Installation Precautions Lead Forming Avoid bend
Text: Precautions and Guidelines for Aluminum Electrolytic Capacitors 1. Guidelines for Circuit Design Selecting the capacitors to suit installation and operating conditions, and using the capacitors to meet the performance limits prescribed in this catalogue or the product specifications.
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RCR-2367B-Guideline
lelon capacitor
LELON electrolytic capacitor
lelon
rzd lelon
electrolytic capacitor vent type
vent capacitor
LELON capacitor reflow soldering
lelon 470
electrolytic capacitor 470
Installation Precautions Lead Forming Avoid bend
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Aluminum PCB process flow
Abstract: 750H ST-100S cleanthrough RCR-2367 RCR-2367B
Text: TECHNICAL NOTE ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE Cautions for Using Aluminum Electrolytic Capacitors With Conductive Polymer Solid Electrolyte Please be sure to read this specification before using this product.
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RCR-2367B
2010/2011E
Aluminum PCB process flow
750H
ST-100S
cleanthrough
RCR-2367
RCR-2367B
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cemedine 540
Abstract: HUmiseal 1A27NS DN83K cemedine fumigation RCR-2367B capacitor electrolyte TF1159 1b66 750H
Text: ALUMINUM ELECTROLYTIC CAPACITORS Cautions for Using Aluminum Electrolytic Capacitors Please read product specifications before using ELNA products. The following cautions should be observed when using our aluminum electrolytic capacitors to assure their maximum
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RCR-2367B
2010/2011E
cemedine 540
HUmiseal 1A27NS
DN83K
cemedine
fumigation
RCR-2367B
capacitor electrolyte
TF1159
1b66
750H
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AVR181: Automotive Grade0 - PCB and Assembly Recommendations
Abstract: ATMEL flow soldering atmel Reflow soldering A104 AECQ100 AEC-Q100 AECQ1001 JESD22 JESD22-A101
Text: AVR181: Automotive Grade0 - PCB and Assembly Recommendations 1. Foreword Modern cars still involve control loops between a set of captors and different actuators elements responsible for the transportation, but also the comfort and the safety of the occupants. To satisfy the constant growth of these elements, car makers and their
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AVR181:
AVR181: Automotive Grade0 - PCB and Assembly Recommendations
ATMEL flow soldering
atmel Reflow soldering
A104
AECQ100
AEC-Q100
AECQ1001
JESD22
JESD22-A101
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capacitor bipolar
Abstract: 750H ST-100S
Text: ALUMINUM ELECTROLYTIC CAPACITORS Cautions for Using Aluminum Electrolytic Capacitors Please read product specifications before using the products. The following cautions should be observed when using our aluminum electrolytic capacitors to assure their maximum stability
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Abstract: No abstract text available
Text: Flow2 packages copyright Vincotech Handling Instruction for flow 2 packages It is valid for all type of flow2 modules: 12/13 mm & 17 mm housing, solder & Press fit pins Handling Instruction 02 01 Ver Soldering option for Press-fit New document Alteration 17.02.2014
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Untitled
Abstract: No abstract text available
Text: Handling Instructions for flow 1B packages This document is valid for all type of flow 1B modules: with solder & Press-fit pins Date: 01.06.2015 Revision: Created by: T. Gyetvai Rev. 01 Proprietary data, company confidential. All rights reserved. Table of Contents
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sn-pb-ag solder preform
Abstract: sn-pb-ag solder preform data sheet AN1908 MRF19090S
Text: MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE Order this document by AN1908/D AN1908 Solder Mounting Method for the MRF19090S and Similar Packages Prepared by: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton
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AN1908/D
AN1908
MRF19090S
sn-pb-ag solder preform
sn-pb-ag solder preform data sheet
AN1908
MRF19090S
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MRF286
Abstract: gold embrittlement motorola PB 1000 AN1674 Aluminum PCB process flow Solder Reflow power rf archive
Text: MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1674 Order this document by AN1674/D AN1674 Mounting Method with Mechanical Fasteners for the MRF286 and Similar Packages INTRODUCTION The following document describes a mounting method for the MRF286 and packages of similar construction using a
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AN1674
AN1674/D
MRF286
gold embrittlement
motorola PB 1000
AN1674
Aluminum PCB process flow
Solder Reflow power rf
archive
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MRF286
Abstract: gold embrittlement AN1674 motorola PB 1000
Text: MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1674 Order this document by AN1674/D AN1674 Mounting Method with Mechanical Fasteners for the MRF286 and Similar Packages Prepared by: Jeanne Pavio and Jerry Mason Motorola Semiconductor Products Sector INTRODUCTION
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AN1674
AN1674/D
MRF286
gold embrittlement
AN1674
motorola PB 1000
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Untitled
Abstract: No abstract text available
Text: Handling Instructions for flow 0 packages This document is valid for all type of flow 0 modules: 12 mm & 17 mm housing, 2 & 4 clips versions, 4 tower version, solder & Press-fit pins Date: 24.04.2015 Revision: Created by: T. Gyetvai Rev. 07 Proprietary data, company confidential. All rights reserved.
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Abstract: No abstract text available
Text: Handling Instructions for flow 1 packages This document is valid for all type of flow 1 modules: 12 mm & 17 mm housing, clips & tower versions, solder & Press-fit pins Date: 25.02.2015 Revision: Created by: T. Gyetvai Rev. 04 Proprietary data, company confidential. All rights reserved.
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Abstract: No abstract text available
Text: flowSCREW 4w packages Copyright Vincotech Handling Instructions for all flowSCREW 4w module housing types: flowSCREW4w, 2xflowSCREW4w, 3xflowSCREW4w Handling Instruction 03 02 01 Ver. rem. sect. 5.2; mod. at sect. 5.1 29.09.2014 remove section 6.2 14.05.2014
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luxeon 5 watt
Abstract: AL 5052 luxeon 3 watt luxeon 10 watt LXHL-LW6C 5mm uv led datasheet philips Loctite 3873 luxeon 1w RED luxeon 1w Loctite 3873 rework
Text: power light source Luxeon V Portable TM Technical Data DS40 Features • Highest Flux LED in the world – 50X LuxeonTM is a revolutionary, energy efficient and ultra compact new light source, combining the lifetime and reliability advantages of Light Emitting
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AOT-0603P-B01A
Abstract: AOT-0603P-B01AZ AOT0603P-B01-V 10E10 10E4 10E6 10E8 3050B aot-0603p diode 47-16
Text: APPROVAL SHEET AOT MODEL NAME AOT PART NUMBER CUSTOMER NAME DATE VERSION MAKER Prepared SMD LED : Blue Color AOT-0603P-B01AZ General Customer 2005/June 2 CUSTOMER Checked Approved AOT HEAD QUARTER No. 13, Gongye 5th. Road, Hsinchu Industrial Park, Hukou Shiang,
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AOT-0603P-B01AZ
2005/June
AOT-0603P-B01A
AOT-0603P-B01AZ
AOT0603P-B01-V
10E10
10E4
10E6
10E8
3050B
aot-0603p
diode 47-16
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Untitled
Abstract: No abstract text available
Text: Handling Instructions for flow 0B packages This document is valid for all type of flow 0B modules with solder pins Date: 05.06.2015 Revision: Created by: Zs. Gyimóthy Rev. 03 Proprietary data, company confidential. All rights reserved. Table of Contents 1
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MRF19090
Abstract: the tom and jerry show AN1923 motorola PB 1000
Text: MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE Order this document by AN1923/D AN1923 Mounting Method with Mechanical Fasteners for the MRF19090 and Similar Packages Prepared by: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods and Mahesh Shah
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AN1923/D
AN1923
MRF19090
the tom and jerry show
AN1923
motorola PB 1000
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MRF19090
Abstract: AN1923
Text: MOTOROLA Order this document by AN1923/D SEMICONDUCTOR APPLICATION NOTE AN1923 Mounting Method with Mechanical Fasteners for the MRF19090 and Similar Packages Prepared by: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods and Mahesh Shah INTRODUCTION This application note describes a mounting method for a
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AN1923/D
AN1923
MRF19090
AN1923
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