ALUMINA CERAMIC AI203 Search Results

ALUMINA CERAMIC AI203 Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
DE6B3KJ151KA4BE01J		Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ471KB4BE01J		Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6E3KJ152MN4A		Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ101KA4BE01J		Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ331KB4BE01J		Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive

ALUMINA CERAMIC AI203 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Alumina ceramic AI203 Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity	Original	PDF
gold metal detectors Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity	Original	PDF
solid solubility Abstract: chemical control process block diagram Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity	Original	PDF
SMD Resistors, Arrays and Networks Abstract: STR 20012 WSK 013 070 eb potentiometer vishay draloric 61 Mini Melf MMA 0204-50 a006 mosfet Micro MELF "Land Pattern" tca 4401 tuner uv 915 Schematic MINIMELF resistors Text: VISHAY I N T E R T E C H N O L O G Y , I N C . INTERACTIVE data book smd resistors, arrays and networks vishay vse-db0010-0611 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents	Original	PDF	vse-db0010-0611 SMD Resistors, Arrays and Networks STR 20012 WSK 013 070 eb potentiometer vishay draloric 61 Mini Melf MMA 0204-50 a006 mosfet Micro MELF "Land Pattern" tca 4401 tuner uv 915 Schematic MINIMELF resistors
Alumina ceramic AI203 Abstract: AI203 CS0805 KJG50 kj 241 Text: - PREMO CS0805F Features CS0805 ceramic wound chip inductor is manufactured under 100% test o f L and Q actual operating frequencies. Fully automatic machine made, this series issues 0-defects. HighQ factor and self-resonance frequencies, allow excellent operation in GSM frequencies,	OCR Scan	PDF	CS0805F CS0805 AI203 max70 100MHz CS0805F-301 150MHz CS0805F-331 CS0805F-361 Alumina ceramic AI203 KJG50 kj 241
Untitled Abstract: No abstract text available Text: - PREMO CS0805F Features CS0805 ceramic wound chip inductor is manufactured under 100% test o f L and Q actual operating frequencies. Fully automatic machine made, this series issues 0-defects. HighQ factor and self-resonance frequencies, allow excellent operation in GSM frequencies,	OCR Scan	PDF	CS0805F CS0805 2nH-1000nH) AI203