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    ALUMINA BALL Search Results

    ALUMINA BALL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    ALUMINA BALL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    maruwa alumina ball

    Abstract: grinding mill alumina ball grinding LH 192 maruwa PORCELAIN A-185
    Text: MARUWA GENERAL CATALOG ALUMINA BALL MARUWA alumina balls are used at glass, porcelain enamel, abrasives, cement, pigment, and other ceramic factories, as well as paint factories, chemical factories, and weak electric appliance makers, as powder grinding media for pot mills, tube mills,


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Resistors Make Possible Ceramic Ball Grid Termination Arrays Ceramic Ball Grid Ceramic Ball Grid CHC Series Termination Arrays Superior TaNFilm resistors on ceramic substrate Termination Arrays High density networks on a reduced footprint High purity alumina


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Chipscale Thevenin Termination Network IRC Advanced Film Division CHC Thevenin Series High purity alumina substrate • High speed digital termination network • Superior TaNFilm resistors on ceramic substrate • JEDEC standard 8-9A compatible Solder balls


    Original     		PDF CC0910L CC0910L 100ppm/

    Untitled

    Abstract: No abstract text available
    Text: Ceramic Ball Grid Termination Arrays IRC Advanced Film Division CHC Series • Superior TaNFilm resistors on ceramic substrate High purity alumina substrate • High density networks on a reduced footprint • Excellent high frequency performance Solder balls


    Original     		PDF CD0865 100ppm/

    Untitled

    Abstract: No abstract text available
    Text: Ceramic Ball Grid Termination Arrays IRC Advanced Film Division CHC Series • Standard tolerances to ±1% High purity alumina substrate • Custom array solutions also available • Excellent high frequency performance • Pb-Free options available — consult factory


    Original     		PDF CD0910 CD0865 100ppm/

    CD1065B-01-50R0-F

    Abstract: 100k7
    Text: Ceramic Ball Grid Termination Arrays IRC Advanced Film Division CHC Series High purity alumina substrate • Superior TaNFilm resistors on ceramic substrate • High density networks on a reduced footprint • Excellent high frequency performance Solder balls


    Original     		PDF CD0865 p100ppm/ 15722R0 CD1065B-01-50R0-F 100k7

    Untitled

    Abstract: No abstract text available
    Text: Ceramic Ball Grid Termination Arrays IRC Advanced Film Division CHC Series • Superior TaNFilm resistors on ceramic substrate High purity alumina substrate • High density networks on a reduced footprint • Excellent high frequency performance • Standard tolerances to ±1%


    Original     		PDF CD0910 100ppm/

    thevenin

    Abstract: No abstract text available
    Text: Chipscale Thevenin Termination Network CHC Thevenin Series • High speed digital termination network • Superior TaNFilm resistors on ceramic substrate • RoHS compliant terminations available • JEDEC standard 9-9A compatible High purity alumina substrate


    Original     		PDF 100ppm/ thevenin

    Untitled

    Abstract: No abstract text available
    Text: BR02M560.0A - Rev B - Page 1 of 2 Construction: •    High Purity Alumina Oxide Substrate Ni alloy thin-film resistive element Ball Grid Array BGA electrodes RoHS compliant (Sn96.5, Ag3.0, Cu0.5, SAC solder)    


    Original     		PDF BR02M560 ON/30

    marking code s22

    Abstract: roundup OC192 marking s11 duobinary
    Text: Product Family: Bessel Absorptive Filter—9th Order Part Number Series: FL9 Series Construction: Features: • • • • • High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS Sn95.5/Ag3.8/Cu0.7


    Original     		PDF Sn63/Pb37) 25Ghz) marking code s22 roundup OC192 marking s11 duobinary

    land pattern BGA 0.75

    Abstract: AG38 10ghz low pass filter marking code s22 SN63 PB37
    Text: Product Family: Bessel Absorptive Filter—7th Order Part Number Series: FL7 Series Construction: Features: • • • • • High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS Sn95.5/Ag3.8/Cu0.7


    Original     		PDF Sn63/Pb37) land pattern BGA 0.75 AG38 10ghz low pass filter marking code s22 SN63 PB37

    Alumina ceramic AI203

    Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
    Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: XO02M610.00 - Rev. C - Page 1 of 2 Construction: •    High purity alumina substrate Copper micro-strip transmission line Epoxy-resin overcoat Lead free, RoHS Sn96.5/Ag3.0/Cu0.5 , 12mil diameter, BGA termination (Gnd-Signal-Gnd) 


    Original     		PDF XO02M610 12mil 20GHz)

    9916h

    Abstract: IPC-7095 9916H transistor 9916h123
    Text: Product Family: High Efficiency Delay Line - Dual Uncoupled Part Number Series: HE-U Series Construction: Features: •        High Purity Alumina or Zirconium Substrate Microstrip Transmission Lines BGA Package


    Original     		PDF CT-9916H-123 SOIC16-AC 9916h IPC-7095 9916H transistor 9916h123

    XOB1208F200S

    Abstract: No abstract text available
    Text: XO02M610.00 - Rev. A - Page 1 of 2 Product Family: High Frequency Crossover Chip Part Number Series: XOB1208F200S Construction: Features: •      High purity alumina substrate Copper micro-strip transmission line Epoxy-resin overcoat


    Original     		PDF XO02M610 XOB1208F200S 12mil 20GHz) XOB1208F200S

    pcb manufacturing

    Abstract: XOB1208F100S
    Text: XO02M610.01 - Rev. A - Page 1 of 2 Product Family: High Frequency Crossover Chip Part Number Series: XOB1208F100S Construction: Features: •       High purity alumina substrate Copper micro-strip transmission line Epoxy-resin overcoat


    Original     		PDF XO02M610 XOB1208F100S 12mil 10GHz pcb manufacturing XOB1208F100S

    Untitled

    Abstract: No abstract text available
    Text: FL02M651.00 - Rev J - Page 1 of 3 Product Family: Bessel Absorptive Filter—7th Order Part Number Series: FL7 Series Construction: Features: •     High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat


    Original     		PDF FL02M651 Sn63/Pb37)

    Untitled

    Abstract: No abstract text available
    Text: FL02M652-00 - Rev. J - Page 1 of 3 Product Family: Bessel Absorptive Filter—9th Order Part Number Series: FL9 Series Construction: Features: •     High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat


    Original     		PDF FL02M652-00 Sn63/Pb37) 25Ghz)

    Untitled

    Abstract: No abstract text available
    Text: HE02M852.00 - Rev F - Page 1 of 2 Construction: •    High Purity Alumina or Zirconium Substrate Microstrip Transmission Lines BGA Package Available in RoHS Sn96.5/Ag3.0/Cu0.5 or Non-RoHS (Sn63/Pb37)     


    Original     		PDF HE02M852 Sn63/Pb37) CT-9916H-123 SOIC16-AC

    Untitled

    Abstract: No abstract text available
    Text: FL02M652-00 - Rev. J - Page 1 of 3 Construction: •    High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS Sn95.5/Ag3.8/Cu0.7 or Non-RoHS (Sn63/Pb37)    


    Original     		PDF FL02M652-00 Sn63/Pb37) 25Ghz)

    Untitled

    Abstract: No abstract text available
    Text: FL02M651.00 - Rev J - Page 1 of 3 Construction: •    High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS Sn95.5/Ag3.8/Cu0.7 or Non-RoHS (Sn63/Pb37)    


    Original     		PDF FL02M651 Sn63/Pb37)

    Untitled

    Abstract: No abstract text available
    Text: BR02M560.0A - Rev B - Page 1 of 2 Product Family: Thin Film SMT Resistor Networks Part Number Series: Miniature BGA Series Construction: Features: •         High Purity Alumina Oxide Substrate Ni alloy thin-film resistive element


    Original     		PDF BR02M560 ON/30

    4701 RESISTOR

    Abstract: No abstract text available
    Text: BR02M560.0A - Rev A - Page 1 of 2 Product Family: Thin Film SMT Resistor Networks Part Number Series: Miniature BGA Series Construction: Features: •         High Purity Alumina Oxide Substrate Ni alloy thin-film resistive element


    Original     		PDF BR02M560 ON/30 4701 RESISTOR

    FR4 substrate height and thickness

    Abstract: FR4 0.8mm thickness FR4 substrate height and thickness 1.2 FR4 height thickness substrate ltcc chip distance ring ltcc fr4 substrate
    Text: NETWORKS Hybrid IC MULTI CHIP MODULE • SYSTEM iN PACKAGE MCM CONSTRUCTION SMD SMD Bonding Wire Bonding Wire Solder BallBall Solder Bare Chip Bare Chip Substrate Substrate Several semiconductors in one package offers downsized system with high performance and standardization


    Original     		PDF D-25578 FR4 substrate height and thickness FR4 0.8mm thickness FR4 substrate height and thickness 1.2 FR4 height thickness substrate ltcc chip distance ring ltcc fr4 substrate