Athlon 64 motherboard design guide
Abstract: Thermal grease silicon thermal grease AMD Athlon 64 AMD xp datasheet amd Athlon xp mobile Athlon XP AMD ATHLON 64 X 2 soil "electrical conductivity" amd Athlon 64 processor data sheet
Text: Thermal Interface Material Comparison: Thermal Pads vs. Thermal Grease Publication # 26951 Revision: 3.00 Issue Date: April 2004 2004 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced
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Abstract: No abstract text available
Text: Advanced Thermal Solutions, Inc. How Air Velocity Affects The Thermal Performance of Heat Sinks: A Comparison of Straight Fin, Pin Fin and maxiFLOWTM Architectures Introduction A device’s temperature affects its op- Air, Ta erational performance and lifetime. To
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aEPF4217
CPF4217
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GFB0412EHS
Abstract: LGA 1207 socket F datasheet dow corning TC-5022 amd socket 1207 O M 335 FFB0812EHE-HS2 TC-5022 FFB0812EHE Socket 940 GK-17
Text: Thermal Design Guide for Socket F 1207 Processors Publication # 32800 Issue Date: August 2006 Revision: 3.00 Advanced Micro Devices 2005 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices,
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Abstract: No abstract text available
Text: EMC1428 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones PRODUCT FEATURES Data Sheet General Description Features The EMC1428 is a high accuracy, low cost, System Management Bus SMBus temperature sensor. Advanced features such as Resistance Error Correction
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EMC1428
EMC1428
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AMD athlon socket 754
Abstract: Athlon 64 motherboard design guide amd athlon 64 socket 754 Socket 754 motherboard with multimeter amd athlon 64 PCB design guide testing motherboards components using multimeter amd athlon 64 3000 TIC-3000
Text: AMD Athlon 64 and AMD Opteron™ Processors Thermal Design Guide Publication # Issue Date: 26633 Rev: September 2003 3.03 2002—2003 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced
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heat and mass transfer
Abstract: No abstract text available
Text: Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603 and PowerPC 604™ RISC Microprocessors Gary B. Kromann m Advanced Packaging Technology Semiconductor Products Sector 3501 Ed Bluestein Blvd, K1 Austin, Texas 78721 ABSTRACT This paper presents various thermal management options
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603TM
604TM
SPECint92/
SPECfp92
21x21
133MHz
heat and mass transfer
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AMD thermal design guide
Abstract: T-pcm905C Thermagon PCM905C AMD athlon design guide T725 temperature controlled fan project AMD Processor Power and Thermal Thermocouple Type T material testing
Text: AMD Thermal, Mechanical, and Chassis Cooling Design Guide Publication # 23794 Rev: B Issue Date: October 2000 2000 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. “AMD” products. AMD makes no representations or
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23794B--October
AMD thermal design guide
T-pcm905C
Thermagon PCM905C
AMD athlon design guide
T725
temperature controlled fan project
AMD Processor Power and Thermal
Thermocouple Type T material testing
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extrusion Heatsinks
Abstract: amd athlon PIN LAYOUT TG051-17 t443 G749 G-749 requirement of cooling tower 200U 300U T725
Text: AMD Thermal, Mechanical, and Chassis Cooling Design Guide Publication # 23794 Rev: A Issue Date: May 2000 2000 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. “AMD” products. AMD makes no representations or
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C1055
Abstract: AMD Processor Power and Thermal t443 200U AMD thermal design amd Power and Thermal AMD athlon design guide AMD Thermal Design Guide
Text: AMD Athlon Processor Thermal Solution Application Note Publication # 22439 Rev: C Issue Date: December 1999 1999 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. “AMD” products. AMD makes no representations or
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Clearance Guidelines
Abstract: Advanced Thermal Solutions superGRIP ATS 369
Text: superGRIPTM Clearance Guidelines Required Board Keep Out Region for superGRIPTM Heat Sink Attachment Hardware ATS-SUPERGRIP_CLEARANCE_GUIDELINES-R1 PATENT PENDING OR PATENT 6308771 7 8 5 6 Advanced Thermal Solutions, Inc PROPRIETARY DIRECTION OF AIR FLOW 2X 10.00
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Thermagon PCM905C
Abstract: HF225UT PCS-TC-11T-13 socket 462 motherboard diagram 462 motherboard electrical diagram Thermocouple Type K material testing Athlon 64 motherboard design guide PCM45 AMD Athlon 64 pin diagram DURON
Text: AMD Thermal, Mechanical, and Chassis Cooling Design Guide Publication # 23794 Rev: H Issue Date: November 2002 2000–2002 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. “AMD” products. AMD makes no representations or
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23794H--November
Thermagon PCM905C
HF225UT
PCS-TC-11T-13
socket 462 motherboard diagram
462 motherboard electrical diagram
Thermocouple Type K material testing
Athlon 64 motherboard design guide
PCM45
AMD Athlon 64 pin diagram
DURON
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AMB048
Abstract: No abstract text available
Text: Search Entire Site Contact IDT | Investors | Press Document Search | Package Search | Parametric Search | Cross Reference Search | Green & RoHS | Calculators | Thermal Data | Reliability & Quality | Military Home > Products > Advanced Memory Buffers > AMB0482C1 > AMB0482C1RJ
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AMB0482C1
AMB0482C1RJ
AMB0482C1
RJ655)
A0702-01
FCBGA-655
TB0801-01
AMB048
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inverter, water cooling system
Abstract: H9047 controlled bridge rectifier dc to ac inverter by thyristor igbt dc to dc chopper control power igbt converter for 690 v
Text: Product Information Main Features Stacks and assemblies • ■ ■ TO SHORTEN YOUR TIME-TO-MARKET Infineon provides reliable and highest quality stacks and assemblies with optimized thermal management. These advanced solutions provide design support and help optimize your system costs.
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B133-H9047-G1-X-7600
inverter, water cooling system
H9047
controlled bridge rectifier
dc to ac inverter by thyristor
igbt dc to dc chopper control
power igbt converter for 690 v
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inverter, water cooling system
Abstract: diode b6u 690v primestack 10000a diodes power igbt converter for 690 v electronic 40 kva ups 7-10KW 2u 62 diode igbt series RECTIFIER DIODE 10000A
Text: Product Information Main Features Stacks and assemblies • ■ ■ TO SHORTEN YOUR TIME-TO-MARKET Infineon provides reliable and highest quality stacks and assemblies with optimized thermal management. These advanced solutions provide design support and help optimize your system costs.
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Advanced Thermal Solutions
Abstract: No abstract text available
Text: SOFTWARE INSTALLATION Installing stageVIEW Follow the below instructions for installing stageVIEW™ software used for ATS automatic temperature and velocity scanners, including the ATVS-2020™, eATVS-4™ & eATVS-8™. Step 1 ccess Advanced Thermal Solutions’ FTP website:
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ATVS-2020â
ATVS-2020
Advanced Thermal Solutions
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PowerPC 601 interface circuit
Abstract: 620t hotwire anemometer powerpc 620 advanced information
Text: Freescale Semiconductor, Inc. Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603 and PowerPC 604™ RISC Microprocessors Gary B. Kromann Freescale Semiconductor, Inc. Advanced Packaging Technology Semiconductor Products Sector
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603TM
604TM
21x21
133MHz
PowerPC 601 interface circuit
620t
hotwire anemometer
powerpc 620 advanced information
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telemecanique LC1 f400
Abstract: NS630H NS400H NS250H c1001 merlin gerin NS80H Telemecanique LC1 EC 19 lc1 f265 telemecanique magnetic contactor NS160H
Text: Selection guide TeSys Model U Starter-controllers Control units Function characteristics Control units Standard LUCA Thermal overload protection Overcurrent protection Advanced LUCB LUCC LUCD 14.2 x the setting current Short-circuit protection Protection against phase loss
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AC-15
DC-13
telemecanique LC1 f400
NS630H
NS400H
NS250H
c1001 merlin gerin
NS80H
Telemecanique LC1 EC 19
lc1 f265
telemecanique magnetic contactor
NS160H
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Radian Heatsinks
Abstract: Intricast Company Electrocube
Text: Stacked-Ceramic Caps Brave High Temperatures By Scott Harris, Advanced Products Marketing Manager, AVX, Myrtle Beach, South Carolina A series of stacked-ceramic capacitors specially designed for SMPSs features the thermal performance of conventional ceramics without
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ISL6388
Abstract: No abstract text available
Text: 40A DrMOS Power Module with Integrated Diode Emulation and Thermal Warning Output ISL99140 Features The ISL99140 is a high performance DrMOS power module designed for high frequency power conversion. By combining a high performance FET driver and MOSFETS in an advanced
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ISL99140
ISL99140
FN8642
ISL6388
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AMD-K6 Processor Data Sheet model 6
Abstract: PGA zif socket 478 AMD "model 8" AMD K6 III data sheet K6 Processor 233 processor cross reference processor FAN temperature dependent speed regulator for fans AMD K6
Text: AMD-K6 ® Processor Thermal Solution Design Application Note Publication # 21085 Rev: I Issue Date: February 1999 Amendment/0 The contents of this document are provided in connection with Advanced Micro Devices, Inc. "AMD" products. AMD makes no representations or
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21085I/0--February
AMD-K6 Processor Data Sheet model 6
PGA zif socket 478
AMD "model 8"
AMD K6 III data sheet
K6 Processor 233
processor cross reference
processor FAN
temperature dependent speed regulator for fans
AMD K6
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sm1 5v 1101
Abstract: TPS658610 over discharge protection circuit for li-ion batt sys 152 tps6585 VLS3012 IUSB100 V32B CH89 diodE k 3561 MOSFET
Text: TPS658610 Advanced Power Management Unit www.ti.com SLVS884 – JUNE 2009 1 Introduction 1.1 Main Features • • • • • BATTERY CHARGER – Complete Charge Management Solution for a Single Cell Li-Ion/Li-Pol Cell With Dynamic Power Management and Thermal
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TPS658610
SLVS884
sm1 5v 1101
TPS658610
over discharge protection circuit for li-ion batt
sys 152
tps6585
VLS3012
IUSB100
V32B
CH89 diodE
k 3561 MOSFET
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tps6585
Abstract: TPS658610 VLS3012 IUSB100 V32B VLS4012 buck converter 2kw
Text: TPS658610 Advanced Power Management Unit www.ti.com SLVS884 – JUNE 2009 1 Introduction 1.1 Main Features • • • • • BATTERY CHARGER – Complete Charge Management Solution for a Single Cell Li-Ion/Li-Pol Cell With Dynamic Power Management and Thermal
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TPS658610
SLVS884
tps6585
TPS658610
VLS3012
IUSB100
V32B
VLS4012
buck converter 2kw
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TPS658620
Abstract: No abstract text available
Text: TPS658620 Advanced Power Management Unit www.ti.com SLVS993 – OCTOBER 2009 1 Introduction 1.1 Main Features • • • • • BATTERY CHARGER – Complete Charge Management Solution for a Single Cell Li-Ion/Li-Pol Cell With Dynamic Power Management and Thermal
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TPS658620
SLVS993
TPS658620
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TPS658620
Abstract: No abstract text available
Text: TPS658620 Advanced Power Management Unit www.ti.com SLVS993 – OCTOBER 2009 1 Introduction 1.1 Main Features • • • • • BATTERY CHARGER – Complete Charge Management Solution for a Single Cell Li-Ion/Li-Pol Cell With Dynamic Power Management and Thermal
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TPS658620
SLVS993
TPS658620
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