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    ADV0812

    Abstract: ALTERA PART MARKING EP3SE110F1152C4N altera top marking DEVICE MARKING CODE table EP3SL110F1152C4N EP3SE260F1152C4N altera date code format XZ-082 EP3SE110F
    Text: Revision: 1.0.0 CUSTOMER ADVISORY ADV0812 ADDITIONAL PACKAGE OPTION FOR SELECTED STRATIX III FPGA DEVICES Description Altera will be introducing the Fine-Line BGA F1152 non-OPD on package decoupling 8-layer substrate design as an additional package option. The Stratix® III FBGA F1152 package is


    Original     		PDF ADV0812 F1152 10-layer XZ0825T JESD46-C, ADV0812 ALTERA PART MARKING EP3SE110F1152C4N altera top marking DEVICE MARKING CODE table EP3SL110F1152C4N EP3SE260F1152C4N altera date code format XZ-082 EP3SE110F

    ADV0804

    Abstract: marking A3 Taiwan semiconductor ALTERA PART MARKING EP3SE50 EP3SL110 MARKed A7 marking a7 altera marking JESD46-C 1/USB/EP3SE110
    Text: Revision: 1.0.0 CUSTOMER ADVISORY ADV0804 TSMC WAFER FABRICATION SITES FOR THE STRATIX III FPGA FAMILY Description Altera will begin shipping Stratix III FPGAs out of two Taiwan Semiconductor Manufacturing Company TSMC wafer fabrication sites: FAB 12, located in Hsinchu, Taiwan, and FAB 14,


    Original     		PDF ADV0804 65-nm JESD46-C, ADV0804 marking A3 Taiwan semiconductor ALTERA PART MARKING EP3SE50 EP3SL110 MARKed A7 marking a7 altera marking JESD46-C 1/USB/EP3SE110

    jesd48b

    Abstract: ADV0813
    Text: Revision: 1.0.0 CUSTOMER ADVISORY ADV0813 PRODUCT DISCONTINUANCE NOTICE PDN POLICY Description Altera’s product discontinuance policy will be aligned with the JEDEC standard JESD48B. Specifically, customers will have a period of 6 months from the issuance date of a PDN to place a


    Original     		PDF ADV0813 JESD48B. jesd48b ADV0813

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22

    Untitled

    Abstract: No abstract text available
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    OCR Scan     		PDF 0G21-80-99 57L062] POSTS00 27JUN96 06-APR-99 arnp40973 /home/Qmp40973/edmmod