AD04-00023-1E Search Results

AD04-00023-1E Result Highlights (6)

Part	Manufacturer	Description
G861AD04511T1EU	Amphenol Communications Solutions	Wafer 2.54mm Pitch STR DIP, 1x4Pin, MATTE TIN, NY66, TAIL=3.4mm, Color-CREAM, Halogen Free, Friction
G861AD04101S1HR	Amphenol Communications Solutions	Wafer 2.54mm Pitch,STR SMT,1x4Pin,G/F,LCP,Color-Black, T&R W/CAP
68000-231HLF	Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
68000-234HLF	Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
68000-232HLF	Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
68000-236	Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch