ABLEBOND 8380 Search Results

ABLEBOND 8380 Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
83808-10010		Amphenol Communications Solutions	Shield (Type I) closed end, with shield insulator
83808-21111		Amphenol Communications Solutions	Shield (Type II ) 1xI/O, with shield insulator and label recess
83808-21010S		Amphenol Communications Solutions	Shield (Type II) 1xI/O, with shield insulator
83808-21010		Amphenol Communications Solutions	Shield (Type II) 1xI/O, with shield insulator
83808-20000S		Amphenol Communications Solutions	Shield (Type II) closed end

ABLEBOND 8380 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Ablebond 8380 Abstract: X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716 Text: Advanced Package Applications: Tape Carrier Package 12.1 12 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is	Original	PDF	ANSI/J-STD-001, Ablebond 8380 X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716
Ablebond 8380 Abstract: A5700 Ablestik 8380 smema nozzle heater shoulder angle foot length lead solder joint reliability tms 3615 A5716 A5707-01 alpha Resistors slide Text: 12 Tape Carrier Package 12.1 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized products. These	Original	PDF
Ablebond 8380 Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping Text: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that	Original	PDF	CH12WIP Ablebond 8380 smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
ablebond 8380 Abstract: land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING Text: CHAPTER 12 ADVANCED PACKAGE APPLICATIONS TAPE CARRIER PACKAGE INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized	Original	PDF	IPC-SM-782A J-STD-001 ablebond 8380 land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING
Ablebond 8380 Abstract: Ablestik 8380 Die Attach epoxy stamping FR4 substrate height and thickness FR4 substrate epoxy FR4 substrate height and thickness 1.2 Ablebond APN3001 Text: Application Note Epoxy Die Attachment for GaAs Flip Chip Devices APN3001 A major concern in developing a process using epoxy as the attachment material for assembly is the exposure to temperatures and subsequent cooling during epoxy curing or the ability of the epoxy to withstand temperature cycling.	Original	PDF	APN3001 6/99A Ablebond 8380 Ablestik 8380 Die Attach epoxy stamping FR4 substrate height and thickness FR4 substrate epoxy FR4 substrate height and thickness 1.2 Ablebond APN3001
Die Attach epoxy stamping Abstract: Ablebond 8380 APN3001 Text: APPLICATION NOTE APN3001: Epoxy Die Attachment for GaAs Flip Chip Devices This application note describes the recommended method for die attachment of GaAs flip chip devices. A major concern in developing a process using epoxy as the attachment material for	Original	PDF	APN3001: Die Attach epoxy stamping Ablebond 8380 APN3001
Ablebond 8380 Abstract: Ablestick 8380 VCT-20 w625c Text: GaAs Flip Chip Schottky Diodes DMK2790-000, DMK2308-000, DMK8001-000 Features Single - DMK2790-000 • Designed for High Volume Designs ■ High Frequency 20–100 GHz ■ Exceeds Environmental Requirements for MIC & Hybrid Applications Anti-Parallel - DMK2308-000	Original	PDF	DMK2790-000, DMK2308-000, DMK8001-000 DMK2308-000 DMK2790-000 8/99A Ablebond 8380 Ablestick 8380 VCT-20 w625c
Ablebond 8380 Abstract: Ablestick 8380 DMK2308-000 DMK2783-000 DMK2790-000 DMK8001-000 diodes in mil grade Text: GaAs Flip Chip Schottky Diodes Features Single - DMK2783-000, DMK2790-000 • Designed for High Volume Designs ■ High Frequency 20–100 GHz ■ Exceeds Environmental Requirements for MIC & Hybrid Applications Anti-Parallel - DMK2308-000 ■ Designed for Low Junction Capacitance	Original	PDF	DMK2783-000, DMK2790-000 DMK2308-000 DMK8001-000 12/02A Ablebond 8380 Ablestick 8380 DMK2308-000 DMK2783-000 DMK2790-000 DMK8001-000 diodes in mil grade
Ablebond 8380 Abstract: No abstract text available Text: GaAs Flip Chip Schottky Diodes Features Single - DMK2783-000, DMK2790-000 • Designed for High Volume Designs ■ High Frequency 20–100 GHz ■ Exceeds Environmental Requirements for MIC & Hybrid Applications Anti-Parallel - DMK2308-000 ■ Designed for Low Junction Capacitance	Original	PDF	DMK8001-000 DMK2308-000 DMK2783-000, DMK2790-000 3/00A Ablebond 8380
Ablebond 8380 Abstract: Ablestick 8380 DMK2308-000 DMK2783-000 DMK2790-000 DMK8001-000 B183 Text: GaAs Flip Chip Schottky Diodes Features Single - DMK2783-000, DMK2790-000 • Designed for High Volume Designs ■ High Frequency 20–100 GHz ■ Exceeds Environmental Requirements for MIC & Hybrid Applications Anti-Parallel - DMK2308-000 ■ Designed for Low Junction Capacitance	Original	PDF	DMK2783-000, DMK2790-000 DMK2308-000 DMK8001-000 leadle005 3/00A Ablebond 8380 Ablestick 8380 DMK2308-000 DMK2783-000 DMK2790-000 DMK8001-000 B183
w76l Abstract: 9m50 Text: Mai nSyst em Opt i on SECCode Loc at i on Name Descr i pt i on Uni t I C0902002197 T7300 2. 0GHz CPU MI CROPROCESSOR; LF80537GG0414M, 2. 0GHz, uFCPGA, 479P, TR, PLASTI C, 1. 05V, 34W, 0t o+10 PC 0C, 4MB, Mer om T7300, FSB800, 4M I CDRAM MODULE; M470T6554,	Original	PDF
Ablebond 8380 Abstract: Ablestick 8380 DMK8001-000 Alpha DMK2790 8380 DMK2308-000 DMK2790-000 Text: •Alpha GaAs Flip Chip Schottky Diodes DMK2790-000, DMK2308-000, DMK8001-000 Features Single - DMK2790-000 tx: ■ Designed for High Volume Designs ■ High Frequency 20-100 GHz m ■ Exceeds Environmental Requirements for MIC & Hybrid Applications fsri	OCR Scan	PDF	DMK2790-000, DMK2308-000, DMK8001-000 8/99A Ablebond 8380 Ablestick 8380 DMK8001-000 Alpha DMK2790 8380 DMK2308-000 DMK2790-000