ABLEBOND 8360 Search Results

ABLEBOND 8360 Result Highlights (6)

Part	ECAD Model	Manufacturer	Description	Download	Buy
NR8360JP-BC-AZ		Renesas Electronics Corporation	φ 30 μm InGaAs Avalanche Photo Diode 14-PIN DIP Module With TEC
2SA1836(0)-T1-A		Renesas Electronics Corporation	Small Signal Bipolar Transistors
10091836-00J-10DLF		Amphenol Communications Solutions	XCede® High Speed Backplane Connectors, 2 wall header.
58360-102LF		Amphenol Communications Solutions	Metral® Board Connectors, Backplane Connectors Right Angle Signal Header, 24 Position Pin-in-Paste HDF.
58360-101TLF		Amphenol Communications Solutions	Metral® Board Connectors, Backplane Connectors Right Angle Signal Header, 24 Position Pin-in-Paste HDF.
58360-203LF		Amphenol Communications Solutions	Metral® Board Connectors, Backplane Connectors Right Angle Signal Header, 24 Position Pin-in-Paste HDF.

ABLEBOND 8360 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
STMicroelectronics marking code date Abstract: Date Code Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 device Marking STMicroelectronics 1076E Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MPG-EEP/04/451 FWH AND LPC FAMILY PLCC32 PACKAGE ENVIRONMENTAL FRIENDLY AND ASSEMBLY LOCATION CHANGE 2004/02/12 PCN MPG-EEP/04/451 Product Family /Commercial Product M50FW M50LPW M50FLW Type Of Change Multiple types of changes	Original	PDF	MPG-EEP/04/451 PLCC32 M50FW M50LPW M50FLW 30-Apr-2004 30-May-2004 STMicroelectronics marking code date Date Code Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 device Marking STMicroelectronics 1076E
TAIYO PSR 4000 Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original	PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100 Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original	PDF
Transistor morocco 9740 Abstract: Ablebond 8360 con hdr hrs ablebond 8086 interfacing with 8254 peripheral Date Code Formats diodes St Microelectronics formatter board Canon interfacing of 8237 with 8086 ST tOP MaRKinGS 388BGA Text: RELIABILITY REPORT Q98001 SICL BUSINESS UNIT REPORT NUMBER : Q98001 QUALIFICATION TYPE : NEW DEVICE - NEW PACKAGE DEVICE : STPC Client SIP101 SALES TYPES : STPCD0166BTC3 - STPCD0175BTC3 TECHNICAL CODE : MDBT*CHDT1BR PROCESS : HCMOS6 - CROLLES FAB LOCATION	Original	PDF	Q98001 SIP101) STPCD0166BTC3 STPCD0175BTC3 388BGA Transistor morocco 9740 Ablebond 8360 con hdr hrs ablebond 8086 interfacing with 8254 peripheral Date Code Formats diodes St Microelectronics formatter board Canon interfacing of 8237 with 8086 ST tOP MaRKinGS