stk*402-270
Abstract: stk408 STK402-270 Sanyo audio amplifier STK402-200 STK402-240 STK408-000 series TM-35 stk402-000 stk402 110
Text: Ordering number : ENN7072 Thick-Film Hybrid IC STK402-270 Three-Channel Class AB Audio Power Amplifier IC 40 W + 40 W + 40 W Overview Package Dimensions The STK402-200 series products are audio power amplifier hybrid ICs that consist of optimally-designed
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ENN7072
STK402-270
STK402-200
STK408-000
4191-SIP19
STK402-270]
stk*402-270
stk408
STK402-270
Sanyo audio amplifier
STK402-240
STK408-000 series
TM-35
stk402-000
stk402 110
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eer3016
Abstract: EER3016 transformer ZD101 22V ZD101 Fuse 250V 2A 56k 1kv 5d-9 BD101 IC301 1k 275vac
Text: www.fairchildsemi.com AB-50 LCD Monitor Applications LC-40W-FSDM07652R – 40 Watts Application FPS Device Input Voltage Range Rated Output Power LCD Monitor FSDM07652R 85–265 Vac 40W Output Voltage Rated Current 5V (2.0A) 12V (2.5A) Features • • •
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AB-50
LC-40W-FSDM07652R
FSDM07652R
240Vac
V/80mA
EER3016
MBRF10100
BD101
2KBP06M3N257
220rst
eer3016
EER3016 transformer
ZD101 22V
ZD101
Fuse 250V 2A
56k 1kv
5d-9
BD101
IC301
1k 275vac
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EER-5345
Abstract: CTV-217W-KA5Q1565RF KA5Q1565RF 10D-9 eer5345 10D9 VR201 L202 ctv circuit diagram EER53
Text: www.fairchildsemi.com AB-40 Color TV Applications CTV-217W-KA5Q1565RF – 217 Watts Application FPS Device Input Voltage Range Rated Output Power C-TV KA5Q1565RF 85–265 Vac 217W Output Voltage Rated Current 125V (1.0A) 20V (1.0A) 16V (3.0A) 12V (2.0A)
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AB-40
CTV-217W-KA5Q1565RF
KA5Q1565RF
EGP20D
EER5345
RT101
10D-9
BD101
IC101
EER-5345
CTV-217W-KA5Q1565RF
KA5Q1565RF
10D-9
eer5345
10D9
VR201
L202
ctv circuit diagram
EER53
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transistor C3
Abstract: EC 401 TRANSISTOR
Text: BLF6G20-40 Power LDMOS transistor Rev. 01 — 19 January 2009 Product data sheet 1. Product profile 1.1 General description 40 W LDMOS power transistor for base station applications at frequencies from 1800 MHz to 2000 MHz. Table 1. Typical performance RF performance at Tcase = 25 °C in a common source class-AB production test circuit.
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BLF6G20-40
BLF6G20-40
transistor C3
EC 401 TRANSISTOR
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EER3530
Abstract: ST-40W-FSDM0565 LF102 EER-3530 FSDM0565 ST-40W BD101 FOD2741 FSDM0565R AB-55
Text: www.fairchildsemi.com AB-55 Set Top Box Applications ST-40W-FSDM0565 – 40 Watts Application FPS Device Input Voltage Range Rated Output Power Set Top Box FSDM0565R 85–265 Vac 40W Output Voltage Rated Current 3.3V (1.5A) 5.0V (1.0A) 9.0V (0.8A) 13V (1.0A)
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AB-55
ST-40W-FSDM0565
FSDM0565R
240Vac
V/80mA
EER3530
EGP20D
EER3530
ST-40W-FSDM0565
LF102
EER-3530
FSDM0565
ST-40W
BD101
FOD2741
FSDM0565R
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stk*404-070
Abstract: STK404-130 STK404-070 STK404-050 STK404-090 STK404-140 transistor ac 125 equivalent stk404-120
Text: Ordering number : ENN7343 Thick-Film Hybrid IC STK404-070 One-Channel Class AB Audio Power Amplifier IC 40 W Overview Package Dimensions The STK404-000 series products are audio power amplifier hybrid ICs that consist of optimally-designed discrete component power amplifier circuits that have
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ENN7343
STK404-070
STK404-000
4198-SIP10
STK404-070]
stk*404-070
STK404-130
STK404-070
STK404-050
STK404-090
STK404-140
transistor ac 125 equivalent
stk404-120
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA672: plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink B D SOT835-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y V T P M K H F D B AJ AG AE e AC heatsink AA W U e2 R N
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HBGA672:
OT835-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA1312: plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink B D SOT624-1 A ball A1 index area A E A2 A1 detail X C e1 AV AT AP AM AK AH AF AD AB Y V T P M K H F D B ∅w M C AW AU AR AN AL AJ AG
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HBGA1312:
OT624-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA600: plastic thermal enhanced ball grid array package; 600 balls; body 40 x 40 x 0.9 mm; heatsink B D SOT605-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y F B AJ AG AE e AC heatsink AA e2 R M D AL U T P H N L J
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HBGA600:
OT605-1
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA1092: plastic thermal enhanced ball grid array package; 1092 balls; body 40 x 40 x 1.75 mm; heatsink SOT948-1 B D D1 A ball A1 index area E1 j E A A2 A1 detail X e1 e AV AT AP AM AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e AU AR
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HBGA1092:
OT948-1
MS-034
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AB-40
Abstract: 6 BIT MUL OF 8051 AB-40 intel B10M intel 8051 application intel 8051 application information
Text: AB-40 APPLICATION BRIEF 32-Bit Math Routines for the 8051 RICK SCHUE REGIONAL APPLICATIONS SPECIALIST INDIANAPOLIS INDIANA October 1992 Order Number 270530-002 Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or copyright for sale and use of Intel products except as provided in
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AB-40
32-Bit
AB-40
6 BIT MUL OF 8051
AB-40 intel
B10M
intel 8051 application
intel 8051 application information
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA760: plastic thermal enhanced ball grid array package; 760 balls; body 40 x 40 x 1.75 mm; heatsink D D1 SOT846-1 B A ball A1 index area j E1 E A A2 A1 detail X C e1 e AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e M M AJ AG e AE AC
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HBGA760:
OT846-1
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA624: plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink D D1 SOT860-1 B A ball A1 index area j E1 E A A2 A1 detail X C e1 e AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e M M AJ AG e AE AC
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HBGA624:
OT860-1
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Untitled
Abstract: No abstract text available
Text: Package outline HBGA596: plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink SOT635-1 B D A D1 ball A1 index area j A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AH AF AD AB Y V T P M AJ AG AC
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HBGA596:
OT635-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline BGA956: plastic ball grid array package; 956 balls; body 40 x 40 x 1.75 mm SOT651-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U
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BGA956:
OT651-1
MS-034
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Untitled
Abstract: No abstract text available
Text: BLF6G10L-40BRN Power LDMOS transistor Rev. 3 — 16 November 2010 Product data sheet 1. Product profile 1.1 General description 40 W LDMOS power transistor for base station applications at frequencies from 700 MHz to 1 GHz. Table 1. Typical performance Typical RF performance at Tcase = 25 °C in a class-AB production test circuit.
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BLF6G10L-40BRN
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Untitled
Abstract: No abstract text available
Text: BLF6G10L-40BRN Power LDMOS transistor Rev. 2 — 27 August 2010 Preliminary data sheet 1. Product profile 1.1 General description 40 W LDMOS power transistor for base station applications at frequencies from 700 MHz to 1 GHz. Table 1. Typical performance Typical RF performance at Tcase = 25 °C in a class-AB production test circuit.
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BLF6G10L-40BRN
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RO4350
Abstract: No abstract text available
Text: BLF6G10L-40BRN Power LDMOS transistor Rev. 3 — 16 November 2010 Product data sheet 1. Product profile 1.1 General description 40 W LDMOS power transistor for base station applications at frequencies from 700 MHz to 1 GHz. Table 1. Typical performance Typical RF performance at Tcase = 25 °C in a class-AB production test circuit.
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BLF6G10L-40BRN
RO4350
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810 souriau
Abstract: ATC100B RO4350 souriau 810
Text: BLF6G10L-40BRN Power LDMOS transistor Rev. 01 — 9 August 2010 Preliminary data sheet 1. Product profile 1.1 General description 40 W LDMOS power transistor for base station applications at frequencies from 700 MHz to 1 GHz. Table 1. Typical performance Typical RF performance at Tcase = 25 °C in a class-AB production test circuit.
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BLF6G10L-40BRN
810 souriau
ATC100B
RO4350
souriau 810
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Untitled
Abstract: No abstract text available
Text: Package outline BGA564: plastic ball grid array package; 564 balls; body 40 x 40 x 1.75 mm SOT947-1 B D D1 A ball A1 index area E1 E A A1 A2 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E
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BGA564:
OT947-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline BGA760: plastic ball grid array package; 760 balls; body 40 x 40 x 1.75 mm SOT652-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E
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BGA760:
OT652-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline BGA656: plastic ball grid array package; 656 balls; body 40 x 40 x 1.75 mm SOT588-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E
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BGA656:
OT588-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline BGA658: plastic ball grid array package; 658 balls; body 40 x 40 x 1.75 mm SOT623-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AH AF AD AB Y V T P M K H F D B AJ e AG AE AC AA W U e2 R N
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BGA658:
OT623-1
MS-034
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AB-40
Abstract: No abstract text available
Text: intel. AB-40 APPLICATION BRIEF 32-Bit Math Routines for the 8051 RICK SCHUE REGIONAL APPLICATIONS SPECIALIST INDIANAPOLIS, IN D IA N A October 1992 Order Number: 270530-002 Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoev
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OCR Scan
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AB-40
32-Bit
/xxxx/0296/B
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