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    A5764 Search Results

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    A5764 Price and Stock

    YAGEO Corporation 9C12063A5764FKHFT

    RES SMD 5.76M OHM 1% 1/4W 1206
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    DigiKey 9C12063A5764FKHFT Reel 5,000
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    • 10000 $0.00388
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    9C12063A5764FKHFT Digi-Reel 1
    • 1 $0.1
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    9C12063A5764FKHFT Cut Tape 1
    • 1 $0.1
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    YAGEO Corporation 9C08052A5764FKHFT

    RES SMD 5.76M OHM 1% 1/8W 0805
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 9C08052A5764FKHFT Digi-Reel 1
    • 1 $0.1
    • 10 $0.1
    • 100 $0.1
    • 1000 $0.1
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    9C08052A5764FKHFT Cut Tape 1
    • 1 $0.1
    • 10 $0.1
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    9C08052A5764FKHFT Reel 5,000
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    • 10000 $0.00307
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    TE Connectivity DBAS-74-12-0-PN-A5764

    DBAS 74-12-0 PN-A5764
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey DBAS-74-12-0-PN-A5764 Bulk 3
    • 1 -
    • 10 $714.2
    • 100 $714.2
    • 1000 $714.2
    • 10000 $714.2
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    TE Connectivity DBAS 74-12-0 PN-A5764

    DAUDBAS 74-12-0 PN-A5764 - Bulk (Alt: ZPF000000000012849)
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    Avnet Americas DBAS 74-12-0 PN-A5764 Bulk 3
    • 1 -
    • 10 $553.817
    • 100 $426.3616
    • 1000 $426.3616
    • 10000 $426.3616
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    Interstate Connecting Components DBAS 74-12-0 PN-A5764
    • 1 $1142.72
    • 10 $727.074
    • 100 $579.24
    • 1000 $579.24
    • 10000 $579.24
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    TE Connectivity DBAS74-12-0PN-A5764

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com DBAS74-12-0PN-A5764
    • 1 $793.55
    • 10 $659.7
    • 100 $659.7
    • 1000 $659.7
    • 10000 $659.7
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    Master Electronics DBAS74-12-0PN-A5764
    • 1 $793.55
    • 10 $659.7
    • 100 $659.7
    • 1000 $659.7
    • 10000 $659.7
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    A5764 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


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    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


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    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


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