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    A5616 Search Results

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    A5616 Price and Stock

    Curtis Industries 260A56-16

    CONN TERM BLK COVER BLACK 16POS
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    DigiKey 260A56-16 Bulk
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    Signal Transformer Inc 14A-56-16

    PWR XFMR LAMINATED 56VA TH
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    DigiKey 14A-56-16 Box 20
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    Master Electronics 14A-56-16
    • 1 $33.54
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    Sager 14A-56-16 40
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    TE Connectivity FDBA 56-16-21 SN-K

    FDBA 56-16-21 SN-K
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    DigiKey FDBA 56-16-21 SN-K Bulk 96
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    Avnet Americas FDBA 56-16-21 SN-K Bulk 96
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    TE Connectivity FDBA 56-16-21 PN-K

    FDBA 56-16-21 PN-K
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    DigiKey FDBA 56-16-21 PN-K Bulk 52
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    Avnet Americas FDBA 56-16-21 PN-K Bulk 52
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    TE Connectivity FDBA 56-16-8 PX-K 090

    Conn Circular M 8 POS Crimp ST Cable Mount 8 Terminal 1 Port - Bulk (Alt: ZPF000000000019424)
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    Avnet Americas FDBA 56-16-8 PX-K 090 Bulk 100
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    Interstate Connecting Components FDBA 56-16-8 PX-K 090
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    A5616 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    tungsten slug glass diode

    Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    A5620

    Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    LDG-A5616RI

    Abstract: 1480I
    Text: UNCONTROLLED DOCUMENT REV, A E.C.N. PART NUMBER REV. LDG -A5616RI A NUMBER AND REVISION COMMENTS 0 3 .2 0 .0 7 E L E C T R O -O P T IC A L CHARACTERISTICS Ta = 2 5 'C PARAM ETER MIN T YP PEAK W AVELENGTH 2 .3 l r =1 OOfiA 1f = 1 OmA Vr jjc d 12ÜOO EMITTED COLOR:


    OCR Scan     		PDF LDG-A5616RI LDG-A5616RI 1480I

    LDG-A5616RI

    Abstract: No abstract text available
    Text: PART NUMBER UNCONTROLLED DOCUMENT REV. LDG -A5616RI PIN 10 PIN 15 4.50 [0.177] 8.00 CO.315] ELECTRO-OPTICAL CHARACTERISTICS Ta = 2 5 X PARAMETER MIN TYP PEAK WAVELENGTH 15.24 [0.600] PIN 9 TEST COND nm 1.8 REVERSE VOLTAGE 2.3 Vf 4.0 AXIAL INTENSITY PIN UNITS


    OCR Scan     		PDF LDG-A5616RI 100juA LDG-A5616RI