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    B1340

    Abstract: sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E
    Text: Q1-2004-MICREL- PKG STORAGE LIFE TEST BAKE TA = + 150C Package Family PKG Type Lds Device WM W-SOIC W-SOIC W-SOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC 16 16 16 20 28 28 28 28 28 28 28 MIC2027 MIC2527 MIC2527 MIC2177 MIC1700B SY69952ZC SY69952ZC


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    PDF Q1-2004-MICREL- MIC2027 MIC2527 MIC2177 MIC1700B SY69952ZC SY87701V B1340 sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY REPORT DATE: 6/29/04 QUALITY ENG : PART NUMBER : DANA TRINH SY100EL16V PROJECT # PACKAGE TYPE ASSEMBLY LOT ID. LOCATION DATE FAB ARRAY PROCESS CODE 22158 8L MSOP UNISEM B807EMEB 233E MICREL EL ASSET1.2 21078 10L TSSOP UNISEM B803F 121C MICREL EL


    Original
    PDF SY100EL16V B807EMEB B803F A425F 1000H 2000H B195B A559E B803FAC B803FBC