BT412
Abstract: BB48 1334 A31 BH292 BK276 BK377 BL301
Text: CASE STYLES OUTLINE DIMENSIONS inch mm case no. B C D E F G H J K BB48 .50 12.70 .39 9.91 .225 5.72 .025 0.63 .07 1.78 .100 2.54 .250 6.35 .350 8.89 .06 1.52 .31 7.87 3.0 A1, E1 BG 291 BG 419 BH292 BJ293 BJ360 BJ398 BK276 . BK 343 BK377 BL301 BL372 BN333
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BH292
BJ293
BJ360
BJ398
BK276
BK343
BK377
BL301
BL372
BN333
BT412
BB48
1334 A31
BH292
BK276
BK377
BL301
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PSD302
Abstract: PSD303 PSD311 waferscale psd3xx PSD301 PSD304R PSD311 PSD312 PSD313 PSD314R
Text: Programmable Peripheral PSD3XX Family Field-Programmable Microcontroller Peripheral Key Features ❏ Single Chip Programmable Peripheral for Microcontroller-based Applications ❏ Wide Operating Voltage Range — L-Versions: 3.0 to 5.5 volts — Others: 4.5 to 5.5 volts
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IS49NLC96400
Abstract: No abstract text available
Text: IS49NLC96400,IS49NLC18320,IS49NLC36160 576Mb x9, x18, x36 Common I/O RLDRAM 2 Memory ADVANCED INFORMATION JULY 2011 FEATURES • 533MHz DDR operation (1.067 Gb/s/pin data rate) 38.4Gb/s peak bandwidth (x36 at 533 MHz
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IS49NLC96400
IS49NLC18320
IS49NLC36160
576Mb
533MHz
533MHz)
144ball)
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IS49NLC36160-18BL
Abstract: FBGA144 IS49NLC96400
Text: IS49NLC96400,IS49NLC18320,IS49NLC36160 576Mb x9, x18, x36 Common I/O RLDRAM 2 Memory ADVANCED INFORMATION JULY 2012 FEATURES • 533MHz DDR operation (1.067 Gb/s/pin data rate) 38.4Gb/s peak bandwidth (x36 at 533 MHz
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IS49NLC96400
IS49NLC18320
IS49NLC36160
576Mb
533MHz
533MHz)
144ball)
IS49NLC36160-18BL
FBGA144
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Untitled
Abstract: No abstract text available
Text: Preliminary GS4576C09/18/36L 144-Ball BGA Commercial Temp Industrial Temp 64M x 9, 32M x 18, 16M x 36 576Mb CIO Low Latency DRAM LLDRAM II 533 MHz–300 MHz 2.5 V VEXT 1.8 V VDD 1.5 V or 1.8 V VDDQ Features Introduction • Pin- and function-compatible with Micron RLDRAM II
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GS4576C09/18/36L
144-Ball
067Gb/s/pin
4576Cxx
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GS4576C36GL-24I
Abstract: GS4576C09GL-24I GS4576C36GL-25I GS4576C18GL-25I GS4576C09GL-25I J2/GS4576C09GL-24I
Text: GS4576C09/18/36L 144-Ball BGA Commercial Temp Industrial Temp 64M x 9, 32M x 18, 16M x 36 576Mb CIO Low Latency DRAM LLDRAM II 533 MHz–300 MHz 2.5 V VEXT 1.8 V VDD 1.5 V or 1.8 V VDDQ Features Introduction • Pin- and function-compatible with Micron RLDRAM II
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GS4576C09/18/36L
144-Ball
576Mb
067Gb/s/pin
4576Cxx
GS4576C36GL-24I
GS4576C09GL-24I
GS4576C36GL-25I
GS4576C18GL-25I
GS4576C09GL-25I
J2/GS4576C09GL-24I
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LLDRAM
Abstract: No abstract text available
Text: Preliminary GS4576C09/18/36L 144-Ball BGA Commercial Temp Industrial Temp 64M x 9, 32M x 18, 16M x 36 576Mb CIO Low Latency DRAM LLDRAM II 533 MHz–300 MHz 2.5 V VEXT 1.8 V VDD 1.5 V or 1.8 V VDDQ Features Introduction • Pin- and function-compatible with Micron RLDRAM II
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GS4576C09/18/36L
144-Ball
067Gb/s/pin
4576Cxx
LLDRAM
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576mb
Abstract: delta A221 J2/GS4576C09GL-24I
Text: Preliminary GS4576C09/18/36L 144-Ball BGA Commercial Temp Industrial Temp 64M x 9, 32M x 18, 16M x 36 576Mb CIO Low Latency DRAM LLDRAM II 533 MHz–300 MHz 2.5 V VEXT 1.8 V VDD 1.5 V or 1.8 V VDDQ Features Introduction • Pin- and function-compatible with Micron RLDRAM II
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GS4576C09/18/36L
144-Ball
067Gb/s/pin
4576Cxx
576mb
delta A221
J2/GS4576C09GL-24I
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J2/GS4576C09GL-24I
Abstract: No abstract text available
Text: Preliminary GS4576C09/18/36L 144-Ball BGA Commercial Temp Industrial Temp 64M x 9, 32M x 18, 16M x 36 576Mb CIO Low Latency DRAM LLDRAM II 533 MHz–300 MHz 2.5 V VEXT 1.8 V VDD 1.5 V or 1.8 V VDDQ Features Introduction • Pin- and function-compatible with Micron RLDRAM II
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GS4576C09/18/36L
144-Ball
067Gb/s/pin
576Mb
4576Cxx
J2/GS4576C09GL-24I
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J2/GS4576C09GL-24I
Abstract: No abstract text available
Text: Preliminary GS4576C09/18/36L 144-Ball BGA Commercial Temp Industrial Temp 64M x 9, 32M x 18, 16M x 36 576Mb CIO Low Latency DRAM LLDRAM II 533 MHz–300 MHz 2.5 V VEXT 1.8 V VDD 1.5 V or 1.8 V VDDQ Features Introduction • Pin- and function-compatible with Micron RLDRAM II
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GS4576C09/18/36L
144-Ball
067Gb/s/pin
4576Cxx
J2/GS4576C09GL-24I
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DK97
Abstract: RLDRAM J2/GS4576C09GL-24I
Text: Preliminary GS4576C09/18/36L 144-Ball BGA Commercial Temp Industrial Temp 64M x 9, 32M x 18, 16M x 36 576Mb CIO Low Latency DRAM LLDRAMTM II 533 MHz–300 MHz 2.5 V VEXT 1.8 V VDD 1.5 V or 1.8 V VDDQ Features Introduction • Pin- and function-compatible with Micron RLDRAM II
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GS4576C09/18/36L
144-Ball
067Gb/s/pin
576Mb
4576Cxx
DK97
RLDRAM
J2/GS4576C09GL-24I
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J2/GS4576C09GL-24I
Abstract: No abstract text available
Text: Preliminary GS4576C09/18/36L 144-Ball µBGA Commercial Temp Industrial Temp 64M x 9, 32M x 18, 16M x 36 576Mb CIO Low Latency DRAM LLDRAM II 533 MHz–300 MHz 2.5 V VEXT 1.8 V VDD 1.5 V or 1.8 V VDDQ Features Introduction • Pin- and function-compatible with Micron RLDRAM II
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GS4576C09/18/36L
144-Ball
576Mb
067Gb/s/pin
4576Cxx
J2/GS4576C09GL-24I
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LLDRAM
Abstract: 144BallBGA A212 A221 ba2163 J2/GS4576C09GL-24I
Text: Preliminary GS4576C09/18/36L 144-Ball BGA Commercial Temp Industrial Temp 64M x 9, 32M x 18, 16M x 36 576Mb CIO Low Latency DRAM LLDRAM II 533 MHz–300 MHz 2.5 V VEXT 1.8 V VDD 1.5 V or 1.8 V VDDQ Features Introduction • Pin- and function-compatible with Micron RLDRAM II
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GS4576C09/18/36L
144-Ball
576Mb
067Gb/s/pin
4576Cxx
LLDRAM
144BallBGA
A212
A221
ba2163
J2/GS4576C09GL-24I
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J2/GS4576C09GL-24I
Abstract: No abstract text available
Text: Preliminary GS4576C09/18/36L 144-Ball BGA Commercial Temp Industrial Temp 64M x 9, 32M x 18, 16M x 36 576Mb CIO Low Latency DRAM LLDRAM II 533 MHz–300 MHz 2.5 V VEXT 1.8 V VDD 1.5 V or 1.8 V VDDQ Features Introduction • Pin- and function-compatible with Micron RLDRAM II
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GS4576C09/18/36L
144-Ball
067Gb/s/pin
4576Cxx
J2/GS4576C09GL-24I
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IS49NLS18320
Abstract: No abstract text available
Text: IS49NLS96400,IS49NLS18320 576Mb x9, x18 Separate I/O RLDRAM 2 Memory ADVANCED INFORMATION JULY 2011 FEATURES • 533MHz DDR operation (1.067 Gb/s/pin data rate) 38.4 Gb/s peak bandwidth (x18 Separate I/O at
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IS49NLS96400
IS49NLS18320
576Mb
533MHz
533MHz)
IS49NLS1832025BLI
IS49NLS9640033BI
IS49NLS9640033BLI
IS49NLS1832033BI
IS49NLS1832033BLI
IS49NLS18320
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IS49NLC96400
Abstract: No abstract text available
Text: IS49NLC96400,IS49NLC18320,IS49NLC36160 576Mb x9, x18, x36 Common I/O RLDRAM 2 Memory ADVANCED INFORMATION FEBRUARY 2012 FEATURES • • • • • • • • • 533MHz DDR operation (1.067 Gb/s/pin data rate) 38.4Gb/s peak bandwidth (x36 at 533 MHz
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IS49NLC96400
IS49NLC18320
IS49NLC36160
576Mb
533MHz
533MHz)
144-ball)
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IS49NLC96400
Abstract: No abstract text available
Text: IS49NLC96400,IS49NLC18320,IS49NLC36160 576Mb x9, x18, x36 Common I/O RLDRAM 2 Memory DECEMBER 2012 FEATURES • • • • • • • • • • 400MHz DDR operation (800Mb/s/pin data rate) 28.8Gb/s peak bandwidth (x36 at 400 MHz clock frequency) Reduced cycle time (15ns at 400MHz)
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IS49NLC96400
IS49NLC18320
IS49NLC36160
576Mb
400MHz
800Mb/s/pin
400MHz)
IS49NLC96400-5BLI
IS49NLC36160-33BLI
IS49NLC18320-5BI
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issi 935
Abstract: DK QK BA1 K11 33bl IS49NLC96400
Text: IS49NLC96400,IS49NLC18320,IS49NLC36160 576Mb x9, x18, x36 Common I/O RLDRAM 2 Memory DECEMBER 2012 FEATURES • • • • • • • • • • 400MHz DDR operation (800Mb/s/pin data rate) 28.8Gb/s peak bandwidth (x36 at 400 MHz clock frequency) Reduced cycle time (15ns at 400MHz)
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IS49NLC96400
IS49NLC18320
IS49NLC36160
576Mb
400MHz
800Mb/s/pin
400MHz)
144-ball
lead20-25BLI
issi 935
DK QK
BA1 K11
33bl
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29LV008
Abstract: AM29LV008 flash am29lv008B PAL PATTERN GENERATOR SA10 SA11
Text: PRELIMINARY Am29LV008T/Am29LV008B 8 Megabit 1,048,576 x 8-Bit CMOS 3.0 Volt-only, Sectored Flash Memory DISTINCTIVE CHARACTERISTICS • 2.7 to 3.6 volt, extended voltage range for read and write operations — Minimizes system-level power requirements ■ Compatibility with JEDEC standards
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Am29LV008T/Am29LV008B
40-pin
16-038-TSOP-1
TSR040
Am29LV008
29LV008
flash am29lv008B
PAL PATTERN GENERATOR
SA10
SA11
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M1017
Abstract: IS49NLS18160
Text: IS49NLS93200,IS49NLS18160 288Mb x9, x18 Separate I/O RLDRAM 2 Memory ADVANCED INFORMATION JULY 2012 FEATURES • 533MHz DDR operation (1.067 Gb/s/pin data rate) 38.4 Gb/s peak bandwidth (x18 Separate I/O at
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IS49NLS93200
IS49NLS18160
288Mb
533MHz
533MHz)
IS49NLS1816025BLI
IS49NLS9320033BI
IS49NLS9320033BLI
IS49NLS1816033BI
IS49NLS1816033BLI
M1017
IS49NLS18160
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BC25 327
Abstract: AF3 din 74 j29 p190 U28 726 IO464 BC25 328 547 B34 R3E28 AH36 AE31
Text: XC4000XLA/XV Field Programmable Gate Arrays January 28, 1999 Version 1.0 0* R XC4000XLA/XV Field Programmable Gate Arrays XC4000XV Family Field Programmable Gate Arrays Package Pinouts XC40110XV Pinout Table XC40110XV Pinout Table (Continued) XC40110XV Pinout Table
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XC4000XLA/XV
XC4000XV
XC40110XV
HQ240
BG352
BG432
BG560
BC25 327
AF3 din 74
j29 p190
U28 726
IO464
BC25 328
547 B34
R3E28
AH36
AE31
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a1018
Abstract: IS49NLS18160
Text: IS49NLS93200,IS49NLS18160 288Mb x9, x18 Separate I/O RLDRAM 2 Memory ADVANCED INFORMATION JULY 2011 FEATURES • 533MHz DDR operation (1.067 Gb/s/pin data rate) 38.4 Gb/s peak bandwidth (x18 Separate I/O at
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IS49NLS93200
IS49NLS18160
288Mb
533MHz
533MHz)
IS49NLS1816025BLI
IS49NLS9320033BI
IS49NLS9320033BLI
IS49NLS1816033BI
IS49NLS1816033BLI
a1018
IS49NLS18160
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2Mbit EPROM
Abstract: 80C196K
Text: Programmable Peripheral PSD3XX Family Field-Programmable Microcontroller Peripheral Key Features □ Single Chip Programmable Peripheral for Microcontroller-based Applications □ Wide Operating Voltage Range — L-Versions: 3.0 to 5.5 volts — Others: 4.5 to 5.5 volts
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386SX
Abstract: VL82C286 t056 5091M TD351 VL82C331 tSU57 LIM EMS 4.0 vlsi 386sx VL82C320
Text: VLSI T e c h n o l o g y , in c . VL82C320 SYSTEM CONTROLLER/DATA BUFFER DESCRIPTION The VL82C320 contains the system control and data buffering functions in a 160-lead quad flat pack. The VL82C320's functions are highly program m able via a set of internal
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VL82C320
VL82C320
160-lead
tim66
160-PIN
386SX
VL82C286
t056
5091M
TD351
VL82C331
tSU57
LIM EMS 4.0
vlsi 386sx
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