Emcore solar cell
Abstract: solar cell triple-junction "solar cell" bare die schottky diode JESD22-B104C CTJ solar cell A12O3 JESD22-b103 JESD22-B104 JESD22-A114
Text: CTJ Receiver Assembly – 10 mm x 10 mm Part No. 615238 DATASHEET SOLAR POWER The Concentrator Triple-Junction CTJ receiver assembly takes the world-class efficiency of EMCORE’s multi-junction space solar cells and combines it with state-of-the-art packaging technology to create the most efficient CPV assembly today.
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JESD22-B104C
A12O3
JESD22-B103B
MIL-STD-883
JESD22-A114
Emcore solar cell
solar cell
triple-junction "solar cell"
bare die schottky diode
JESD22-B104C
CTJ solar cell
JESD22-b103
JESD22-B104
JESD22-A114
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nichrome resistor failures
Abstract: Resistor 135C
Text: MIC Technology Vishay Electro-Films Applications and Design of Thin Film Resistors INTRODUCTION RESISTOR DESIGN CONSIDERATIONS In general, there are four parameters of concern to the engineer when designing a resistor; the resistor value, its change in value
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01-Dec-04
nichrome resistor failures
Resistor
135C
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smd 233
Abstract: mosfet sn60 SMD10 AN-996J smd Y 4 SMD Y s JC SMD smd igbt SN60PB40 3 A SMD
Text: APPLICATION NOTES PUBLISHED BY INTERNATIONAL RECTIFIER, 233 KANSAS STREET, EL SEGUNDO, CA 90245, 310 322-3331 AN-996J SMD10 デバイスのアセンブリに関する ガイドライン Guido Dokopoulos 訳：アイアールファーイースト株式会社
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AN-996J
SMD10
10IGBT
SMD-10
smd 233
mosfet sn60
SMD10
AN-996J
smd Y 4
SMD Y s
JC SMD
smd igbt
SN60PB40
3 A SMD
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solid solubility
Abstract: chemical control process block diagram
Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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gold metal detectors
Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
Text: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of
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CH03WIP
gold metal detectors
soft solder die bonding
schematic diagram intel atom
INCOMING RAW MATERIAL INSPECTION
lead side brazed hermetic
X-RAY INSPECTION
ausi die attach
electrical three phase schematic riser DIAGRAM
epoxy adhesive paste cte table
intel 24008
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OSW-8339
Abstract: OSW-8349 A12O3
Text: High Power LED OS-83 Series Features: • Super High Luminance • All chips can be individually driven to provide the required colour OSW-8349 OSW-8339 G B R 1.64 6 1 2 5 2 3 4 3 G 6 R 5 B 4 3 23.75 2 2 1 1.66 1 3 1 1 2 3 1 2 3 B R 3.5 G 24.3 µ µ Electrical & Optical Characteristics at Ta=25 C
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OS-83
OSW-8349
OSW-8339
350mA
A12O3
OSW-8339
OSW-8349
A12O3
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Signal Path Designer
Abstract: No abstract text available
Text: MIC Technology Vishay Electro-Films Cost-effective High Volume Interconnect Substrate Solutions INTRODUCTION SUBSTRATES The evolving requirements for high density interconnects has driven Vishay MIC Technology to offer a high volume manufacturing capability to answer our customers needs for
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23-Nov-04
Signal Path Designer
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solar cell
Abstract: Emcore solar cell bare die schottky diode JESD22-B104C JESD22-B103-B triple-junction "solar cell" JESD22-B103B A12O3 multi-junction "solar cell" JESD22-B104
Text: CTJ Receiver Assembly – 5.5 mm x 5.5 mm Part No. 615245 DATASHEET SOLAR POWER The Concentrator Triple-Junction CTJ receiver assembly takes the world-class efficiency of EMCORE’s multi-junction space solar cells and combines it with state-of-the-art packaging technology to create the most efficient CPV assembly today.
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Original
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JESD22-B104C
A12O3
JESD22-B103B
MIL-STD-883
JESD22-A114
solar cell
Emcore solar cell
bare die schottky diode
JESD22-B104C
JESD22-B103-B
triple-junction "solar cell"
JESD22-B103B
multi-junction "solar cell"
JESD22-B104
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VISHAY film resistors
Abstract: SIGNAL PATH DESIGNER
Text: VISHAY ELECTRO-FILMS Vishay Film Resistors Tech Note Cost-effective High Volume Interconnect Substrate Solutions Introduction Using the Guide The evolving requirements for high density interconnects has driven Vishay EFI Technology to offer a high volume manufacturing capability to answer our customers needs for
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15-Mar-07
VISHAY film resistors
SIGNAL PATH DESIGNER
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Untitled
Abstract: No abstract text available
Text: Model. No. Rev. FYLS-0402UWC A PRODUCT SPECIFICATION Model No. ：FYLS-0402UWC Features: •SMD Type ■Size mm :1.0*0.5*0.35 NEW ■Emitting Color:White ■SMT package ■Suitable for all SMT assembly and soldering method ■Pb-free Reflow soldering application
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FYLS-0402UWC
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Untitled
Abstract: No abstract text available
Text: Model. No. Rev. FYLS-3528BUWC A PRODUCT SPECIFICATION Model No.： ：FYLS-3528BUWC Features: •TOP LED Type ■ Size mm :3.5*2.8*1.38 ■ Emitting Color:White ■ SMT package ■ Suitable for all SMT assembly and soldering method ■ Pb-free Reflow soldering application
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FYLS-3528BUWC
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gold metal detectors
Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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Untitled
Abstract: No abstract text available
Text: Model. No. Rev. FYLS-3528UW2C A PRODUCT SPECIFICATION Model No.： ：FYLS-3528UW2C Features: •TOP LED Type ■ Size mm :3.5*2.8*1.9 ■ Emitting Color:White ■ SMT package ■ Suitable for all SMT assembly and soldering method ■ Pb-free Reflow soldering application
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FYLS-3528UW2C
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waveguide selective switch
Abstract: quartz optical properties MSI nichrome resistor A1203 Thin Film Capacitors AI and Au wirebonding NICHROME wire 0.005 mm2 microwave circulators AT*T Wireless Services coupler AT*T coupler conductor
Text: MIC Technology Vishay Electro-Films An Introduction To Substrate PIMICTM Passive Intergrated Micro-Electron Interconnect Circuitry Technology Thin film microwave integrated circuits have been evolving from a simple substrate medium which carries microwave/
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02-Dec-04
waveguide selective switch
quartz optical properties
MSI nichrome resistor
A1203
Thin Film Capacitors
AI and Au wirebonding
NICHROME wire 0.005 mm2
microwave circulators
AT*T Wireless Services coupler
AT*T coupler conductor
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