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Catalog Datasheet	MFG & Type	Document Tags	PDF
DN3535 Abstract: No abstract text available Text: DN3535 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) DN3535 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si	Original	DN3535 DN3535 A0203209	PDF

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DN3535

Abstract: No abstract text available
Text: DN3535 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) DN3535 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si

Original

DN3535 DN3535 A0203209

PDF