LND150
Abstract: No abstract text available
Text: LND150 Die Specification Pad Layout 2 3 1 0,0 Backside: Source Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 11 ± 1.5 None 1 (mils) LND150 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Source
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LND150
LND150
A013009
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HV5530
Abstract: No abstract text available
Text: HV5530 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 45 1 0,0 44 43 42 41 40 39 38 37 36 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 133
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HV5530
HV5530
A013009
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pocket Scale block diagram
Abstract: No abstract text available
Text: HV9903 White LED Driver IC Features ► Power efficiency of up to 85% ► Drives up to six white LEDs ► 2.6 - 4.6V supply power stage can operate at 1.8V see page 7 ► Built-in soft start ► DC and PWM dimming control ► Built-in open LED protection
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HV9903
500nA
DSFP-HV9903
A013009
pocket Scale block diagram
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Untitled
Abstract: No abstract text available
Text: VP0550 P-Channel Enhancement-Mode Vertical DMOS FETs Features General Description ► ► ► ► ► ► ► The Supertex VP0550 is an enhancement-mode normallyoff transistor that utilizes a vertical DMOS structure and Supertex’s well-proven silicon-gate manufacturing
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VP0550
DSFP-VP0550
A013009
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LP0701
Abstract: No abstract text available
Text: LP0701 Die Specification Pad Layout 1 2 3 0,0 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 50 70 11 ± 1.5 None 1 (mils) LP0701 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain
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LP0701
LP0701
A013009
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HV4622
Abstract: No abstract text available
Text: HV4622 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 45 1 0,0 44 43 42 41 40 39 38 37 Back Side Bonding Pad Material Bond Wire Bond Wire Size VSS Al/Cu/Si Au 1.3 36 Die Specifications
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HV4622
HV4622
A013009
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HV5122
Abstract: No abstract text available
Text: HV5122 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 45 1 0,0 44 43 42 41 40 39 38 37 36 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 133
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HV5122
HV5122
A013009
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HV5622
Abstract: No abstract text available
Text: HV5622 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 45 1 0,0 44 43 42 41 40 39 38 37 36 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 133
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HV5622
HV5622
A013009
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HV3418
Abstract: No abstract text available
Text: HV3418 Die Specification Pad Layout 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 25 42 24 43 23 44 22 45 21 46 20 47 19 48 18 49 17 50 16 51 15 52 14 53 13 54 12 55 11 56 10 57 9 58 8 59 7 60 6 61 5 62 4 63 3 64 2 65 1 76 0,0 75 74 73 72 71 70 69 68 66
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HV3418
HV3418
1235plications,
A013009
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HV514
Abstract: No abstract text available
Text: HV514 Die Specification Pad Layout 5 6 7 8 9 10 11 12 13 4 14 3 2 16 17 1 0,0 25 24 23 22 21 20 19 18 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 134 91 20 ± 1.0 None 1 (mils) HV514 1 (mils) Back Side Bonding Pad
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HV514
HV514
A013009
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HV633
Abstract: No abstract text available
Text: HV633 Die Specification Pad Layout 0,0 21 22 20 23 19 24 18 25 17 26 16 27 15 28 14 29 13 30 12 31 11 32 10 33 9 34 8 35 7 36 6 37 5 38 4 39 3 40 1 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 Die Specifications Die Dimensions Device Length Width
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HV633
HV633
A013009
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sivp
Abstract: VP0808L-G 125OC VP0808
Text: VP0808 Features ► ► ► ► ► ► ► P-Channel Enhancement-Mode Vertical DMOS FETs General Description Free from secondary breakdown Low power drive requirement Ease of paralleling Low CISS and fast switching speeds High input impedance and high gain
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VP0808
VP0808
DSFP-VP0808
A013009
sivp
VP0808L-G
125OC
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HV583
Abstract: No abstract text available
Text: HV583 Die Specification Pad Layout 70 71 72 73 69 • • • • • • • • • • • • • • • • • • • • • • • • • 5 4 3 2 1 0,0 74 75 78 79 76 77 80 • • • • • • • • • • • • • • • • • •
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HV583
HV583
A013009
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HV5522
Abstract: No abstract text available
Text: HV5522 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 45 1 0,0 44 43 42 41 40 39 38 37 36 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 133
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HV5522
HV5522
A013009
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HV574
Abstract: A0130
Text: HV574 Die Specification Pad Layout 33 32 35 34 37 36 39 38 41 40 43 42 45 44 47 46 49 48 51 50 52 31 0,0 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11
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HV574
HV574
A013009
A0130
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