XCN06012 Search Results

XC4VLX25-11FF668I

Abstract: XC4VSX35-10FF668C XC4VSX35-10FFG668I XC4VLX25-10FF668C XC2VP20-5FF896C XC4VLX40-10FF668I XC4VLX25-10FF668I XC4VSX35-11FF668I XC2VP30-7FF896C XC4VSX25
Text: Additional Source for Thermal Adhesive in Certain Flip-Chip Packages for Virtex-II, Virtex-II Pro, and Virtex-4 FYI−For Your Information XCN06012 v1.0 May 1, 2006 Overview This notice describes the qualification of a second source thermal adhesive and lid attach adhesive material for flip-chip