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    TXC-04218 Search Results

    TXC-04218 Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    68004-218HLF Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail. Visit Amphenol Communications Solutions
    10145204-218KLF Amphenol Communications Solutions Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface Mount, 18 Position,side to side double row,Top latch

    (For product qualification latest status, please submit Product Enquiry)    		 Visit Amphenol Communications Solutions
    68604-218HLF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions

    TXC-04218 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    TXC-04218AIOG TranSwitch 8 Channel Dual Bus Mapper Original PDF