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    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA273: plastic thin fine-pitch ball grid array package; 273 balls A B D SOT1051-1 ball A1 index area E A2 A A1 detail X e1 ∅v ∅w b e W V U T R P N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9


    Original     		TFBGA273: OT1051-1 MO-195 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA273 package SOT1051-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		TFBGA273 OT1051-1 OT1051-1 PDF