TFA9981UK Search Results

TFA9981UK Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Type	PDF
TFA9981UK		NXP Semiconductors	Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm		Original	PDF

TFA9981UK Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Package outline WLCSP9: wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm A B D TFA9981UK bump A1 index area A2 E A A1 detail X e1 e ∅v ∅w b C C A B C y C e e2 B A bump A1 index area 1 2 3 X 0.5 Dimensions Unit mm max nom min 1 mm scale A 0.6	Original	PDF	TFA9981UK tfa9981uk

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: Package outline WLCSP9: wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm A B D TFA9981UK bump A1 index area A2 E A A1 detail X e1 e ∅v ∅w b C C A B C y C e e2 B A bump A1 index area 1 2 3 X 0.5 Dimensions Unit mm max nom min 1 mm scale A 0.6

Original

PDF

TFA9981UK tfa9981uk