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    TDPF-1950L-19 Search Results

    TDPF-1950L-19 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54121-810201950LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    54112-118481950LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 48 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    54242-110161950LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    54122-410401950LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch Visit Amphenol Communications Solutions
    77313-119-50LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 50 Positions Visit Amphenol Communications Solutions

    TDPF-1950L-19 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    TDPF-1950L-19 TOKO CERAMIC DUPLEXER FOR W-CDMA Original PDF