SN74LS375N
Abstract: SN54LS375J SN74LS375D SN74LS375DE4 SN74LS375DG4 SN74LS375DR SN74LS375DRE4 SN74LS375DRG4 SN74LS375J SN74LS375N3
Text: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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4-Jun-2007
SN54LS375J
SN74LS375D
Level-1-260C-UNLIM
SN74LS375DE4
SN74LS375N
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375DR
SN74LS375DRE4
SN74LS375DRG4
SN74LS375J
SN74LS375N3
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) SN54LS375J ACTIVE CDIP J 16 1
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21-Mar-2013
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375J
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SN54LS375J
Abstract: SN74LS375D SN74LS375DE4 SN74LS375DG4 SN74LS375DR SN74LS375DRE4 SN74LS375DRG4 SN74LS375J SN74LS375N SN74LS375N3
Text: PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SN74LS375D ACTIVE SOIC D 16
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15-Oct-2009
SN54LS375J
SN74LS375D
Level-1-260C-UNLIM
SN74LS375DE4
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375DR
SN74LS375DRE4
SN74LS375DRG4
SN74LS375J
SN74LS375N
SN74LS375N3
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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4-Jun-2007
SN54LS375J
SN74LS375D
Level-1-260C-UNLIM
SN74LS375DE4
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SN74LS375N
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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4-Jun-2007
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375DR
SN74LS375N
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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4-Jun-2007
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375DR
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish A42 MSL Peak Temp Samples (Requires Login) SN54LS375J ACTIVE CDIP J 16 1 TBD SN74LS375D
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17-Aug-2012
SN54LS375J
SN74LS375D
Level-1-260C-UNLIM
SN74LS375DE4
Level-1-260C-
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) SN54LS375J ACTIVE CDIP J 16
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10-Jun-2014
SN54LS375J
SN74LS375D
Level-1-260C-UNLIM
LS375
SN74LS375J
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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4-Jun-2007
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375DR
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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4-Jun-2007
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375DR
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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4-Jun-2007
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375DR
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SN54LS375
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 28-Aug-2010 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish A42 MSL Peak Temp (3) Samples (Requires Login) SN54LS375J ACTIVE CDIP J 16 1 TBD N / A for Pkg Type
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28-Aug-2010
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375J
SN54LS375
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