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    Infineon Technologies AG SIGC42T170R3GEX1SA2

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC42T170R3GEX1SA)
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    Avnet Americas SIGC42T170R3GEX1SA2 Waffle Pack 5,760
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    Untitled

    Abstract: No abstract text available
    Text: SIGC42T170R3GE IGBT3 Power Chip Features: • 1700V Trench + Field Stop technology  low turn-off losses  short tail current  positive temperature coefficient  easy paralleling Chip Type VCE SIGC42T170R3GE 1700V This chip is used for:  power module


    Original     		PDF SIGC42T170R3GE SIGC42T170R3GE L7751M, L7751T, L7751E,

    Untitled

    Abstract: No abstract text available
    Text: SIGC42T170R3GE IGBT3 Chip Features: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type VCE SIGC42T170R3GE 1700V This chip is used for: • power module


    Original     		PDF SIGC42T170R3GE SIGC42T170R3GE L7751T,