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    SIGC101T170R3E Price and Stock

    Infineon Technologies AG SIGC101T170R3EX1SA

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC101T170R3EX1SA)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC101T170R3EX1SA Waffle Pack 2,340
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    Infineon Technologies AG SIGC101T170R3EX1SA2

    (Alt: SP000906252)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    EBV Elektronik SIGC101T170R3EX1SA2 2 Weeks 1
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    SIGC101T170R3E Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    tsc 1003

    Abstract: No abstract text available
    Text: SIGC101T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling This chip is used for: • power modules C Applications: • drives


    Original     		PDF SIGC101T170R3E L7771T, tsc 1003

    Untitled

    Abstract: No abstract text available
    Text: SIGC101T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology  low turn-off losses  short tail current  positive temperature coefficient  easy paralleling This chip is used for:  power modules C Applications:  drives


    Original     		PDF SIGC101T170R3E L7777M, L7777T, L7777E,