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    Infineon Technologies AG SIDC14D120H8X1SA1

    Diode Switching 25A DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC14D120H8X1SA1)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIDC14D120H8X1SA1 Waffle Pack 20 Weeks 16,911
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    SIDC14D120H8 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SIDC14D120H8X1SA1 Infineon Technologies Discrete Semiconductor Products - Diodes - Rectifiers - Single - DIODE GEN PURP 1.2KV 25A WAFER Original PDF

    SIDC14D120H8 Datasheets Context Search

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    Abstract: No abstract text available
    Text: SIDC14D120H8 Fast switching diode chip in Emitter Controlled Technology Features: • 1200V technology 120 µm chip  soft, fast switching  low reverse recovery charge  small temperature coefficient  qualified according to JEDEC for target applications


    Original     		PDF SIDC14D120H8 L4055C,

    soft solder die bonding

    Abstract: No abstract text available
    Text: SIDC14D120H8 Fast switching diode chip in Emitter Controlled -Technology Features: • 1200V Emitter Controlled technology 120 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient A This chip is used for: • EUPEC power modules and


    Original     		PDF SIDC14D120H8 L4055C, soft solder die bonding