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    Infineon Technologies AG SIDC02D60C6X1SA4

    Diode Switching 6A DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC02D60C6X1SA4)
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    Avnet Americas SIDC02D60C6X1SA4 Waffle Pack 1,918
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    SIDC02D60C6 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SIDC02D60C6 Infineon Technologies Used for IGBT3 Original PDF
    SIDC02D60C6X1SA4 Infineon Technologies Discrete Semiconductor Products - Diodes - Rectifiers - Single - DIODE GEN PURP 600V 6A WAFER Original PDF

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    FS6R06VE3

    Abstract: SIDC02D60C6 L4991M l4991
    Text: SIDC02D60C6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient A This chip is used for: • power module • discrete components


    Original     		PDF SIDC02D60C6 L4991M, FS6R06VE3 SIDC02D60C6 L4991M l4991

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    Abstract: No abstract text available
    Text: SIDC02D60C6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR SIDC02D60C6 600V IF C Applications: • drives


    Original     		PDF SIDC02D60C6 Q67050-A4349A101 L4991M,

    L4991M

    Abstract: SIDC02D60C6
    Text: SIDC02D60C6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR SIDC02D60C6 600V IF C Applications: • drives


    Original     		PDF SIDC02D60C6 Q67050-A4349A101 L4991M, L4991M SIDC02D60C6