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L77HDEG15SOL2RM8
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 15 Socket, Flash Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) |
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L177HDEG15SOL2RM8
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 15 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) |
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L177TSAG15SOL2RM5
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Straight PCB Thru Hole Low Profile, Height=6.02mm (.237in), 15 Socket, Bright Tin Shell, 0.38um (15u\\) Gold, M3 Threaded Boardlock |
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L77TSAG15SOL2RM8
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Straight PCB Thru Hole Low Profile, Height=6.02mm (.237in), 15 Socket, Bright Tin Shell, Flash Gold, M3 Threaded Boardlock with M3 Front Screwlock Installed |
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L77DAG15S1AMN
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Amphenol Communications Solutions
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Dsub, Machined signal 7.5A, Right Angle PCB Thru Hole, FP=10.3mm, Cnt Row Spacing 2.54mm, Cnt Tail 0.6mm, 15 Socket, Bright Tin Shell, Flash Gold, M3 Threaded Rear Insert, Metal R/A Bracket Without Boardlock |
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