RMPA1766 Search Results

RMPA1766 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
GTO MODULE Abstract: ECJ-1VB1H102K SN63 SN96 Solder Paste, Indium 5.8 Text: PRELIMINARY RMPA1766 i-Lo tm WCDMA Band IV Power Amplifier Module Features General Description • 40% WCDMA efficiency at +28dBm Pout The RMPA1766 Power Amplifier Module PAM is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA	Original	PDF	RMPA1766 28dBm 16dBm) 16dBm GTO MODULE ECJ-1VB1H102K SN63 SN96 Solder Paste, Indium 5.8

Catalog Datasheet

MFG & Type

PDF

Document Tags

GTO MODULE

Abstract: ECJ-1VB1H102K SN63 SN96 Solder Paste, Indium 5.8
Text: PRELIMINARY RMPA1766 i-Lo tm WCDMA Band IV Power Amplifier Module Features General Description • 40% WCDMA efficiency at +28dBm Pout The RMPA1766 Power Amplifier Module PAM is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA

Original

PDF

RMPA1766 28dBm 16dBm) 16dBm GTO MODULE ECJ-1VB1H102K SN63 SN96 Solder Paste, Indium 5.8