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Catalog Datasheet	MFG & Type	PDF	Document Tags
KMC-166 Abstract: A112 TEXAS INSTRUMENTS, Mold Compound Text: TEXAS INSTRUMENTS Final Notification for the Manufacture of 48/56 Pin TSSOP Package DGG at the TI Sherman Assembly/Test Facility November 12, 1996 Abstract As previously notified in March by PCN5249 Texas Instruments Advanced System Logic Products (ASL) has qualified the TI Sherman Assembly/Test Prototyping Facility to manufacture	Original	PDF	PCN5249 KMC-166 A112 TEXAS INSTRUMENTS, Mold Compound

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KMC-166

Abstract: A112 TEXAS INSTRUMENTS, Mold Compound
Text: TEXAS INSTRUMENTS Final Notification for the Manufacture of 48/56 Pin TSSOP Package DGG at the TI Sherman Assembly/Test Facility November 12, 1996 Abstract As previously notified in March by PCN5249 Texas Instruments Advanced System Logic Products (ASL) has qualified the TI Sherman Assembly/Test Prototyping Facility to manufacture

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PCN5249 KMC-166 A112 TEXAS INSTRUMENTS, Mold Compound