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Catalog Datasheet	Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: Thermal Relief Doc ID: PAN1104081 By: Eddy van Keulen Date: 8-Apr-2011 The DFN and QFN packages of the PhaseLink IC’s have a large solder pad in the middle. The official function of this pad is to aid thermal conductivity from the chip to the PCB to lower the thermal resistance	Original	PAN1104081 8-Apr-2011 QFN-16L 100mW. 100mW	PDF

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Untitled

Abstract: No abstract text available
Text: Thermal Relief Doc ID: PAN1104081 By: Eddy van Keulen Date: 8-Apr-2011 The DFN and QFN packages of the PhaseLink IC’s have a large solder pad in the middle. The official function of this pad is to aid thermal conductivity from the chip to the PCB to lower the thermal resistance

Original

PAN1104081 8-Apr-2011 QFN-16L 100mW. 100mW

PDF