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    mc33902

    Abstract: MCZ3390 ISO11898 KIT33902EFEVBE SG1002 SG187 HSCAN
    Text: Analog, Mixed-Signal and Power Management MC33902 High speed CAN interface with embedded 5.0 V supply Applications MC33902 Simplified Application Drawing • High speed in-vehicle Networks • Body Control Systems • Engine Control • Transmission Control


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    PDF MC33902 MC33902 14-PIN 98ASA10774D MC33902FS, MCZ3390 ISO11898 KIT33902EFEVBE SG1002 SG187 HSCAN

    mc33902

    Abstract: tlpn 1N4004 IEC61000-4 ISO11898 MCZ33902EFR2 PSPI
    Text: Freescale Semiconductor Advance Information Document Number: MC33902 Rev. 3.0, 8/2009 High Speed CAN Interface with Embedded 5.0 V Supply 33902 The MC33902 is a high speed CAN physical interface. The device includes an internal 5.0 V supply for the CAN bus transceiver, and


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    PDF MC33902 MC33902 ISO11898 tlpn 1N4004 IEC61000-4 MCZ33902EFR2 PSPI

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Advance Information Document Number: MC33902 Rev. 3.0, 8/2009 High Speed CAN Interface with Embedded 5.0 V Supply 33902 The MC33902 is a high speed CAN physical interface. The device includes an internal 5.0 V supply for the CAN bus transceiver, and


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    PDF MC33902 MC33902 ISO11898

    Nexus S JTAG pins

    Abstract: mPC5746m Nexus S camera
    Text: Freescale Semiconductor Application Note Document Number: AN4566 Rev 1, 05/2013 MPC5746M Hardware Design Guide by: Martin Vaupel and David McMenamin Contents 1 Introduction 1 The MPC5746M is a multi-core 32-bit microcontroller


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    PDF AN4566 MPC5746M 32-bit e200z4 200MHz. Nexus S JTAG pins Nexus S camera

    samsung EMMC user guide

    Abstract: Jedec lpddr2 samsung lpddr2 Mobile RAM samsung eMMC 4.5 MX53UG n78c AMBA AXI dma controller designer user guide lpddr2 layout SONY VTR M15 DIAGRAM DDR3 jedec
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 4, 11/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information


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    PDF IMX53AEC MCIMX53xA MX53xA MX53xA) 1080i/p samsung EMMC user guide Jedec lpddr2 samsung lpddr2 Mobile RAM samsung eMMC 4.5 MX53UG n78c AMBA AXI dma controller designer user guide lpddr2 layout SONY VTR M15 DIAGRAM DDR3 jedec

    Samsung eMMC 4.41

    Abstract: LPDDR2 SDRAM samsung i.MX53 USB_OTG emmc spec samsung samsung EMMC user guide samsung lpddr2 eMMC 4.4 Jedec lpddr2 sahara lcd monitor circuit diagram free
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 3, 7/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information


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    PDF IMX53AEC MCIMX53xA MX53xA MX53xA) 1080i/p Samsung eMMC 4.41 LPDDR2 SDRAM samsung i.MX53 USB_OTG emmc spec samsung samsung EMMC user guide samsung lpddr2 eMMC 4.4 Jedec lpddr2 sahara lcd monitor circuit diagram free

    pin vga CRT pinout

    Abstract: samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 3, 7/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm


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    PDF IMX53CEC MCIMX53xD MX53xD pin vga CRT pinout samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2

    DDR3 phy 100 pin diagram

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 1, 3/2011 MCIMX53xD This document contains information on a new product. Specifications and information herein are subject to change without notice. i.MX53xD Applications


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    PDF IMX53CEC MCIMX53xD MX53xD DDR3 phy 100 pin diagram

    samsung eMMC 4.5

    Abstract: schema tv sony USB_OTG i.mx53 emmc spec samsung SAHA Camera Module CSI2 samsung EMMC user guide DDR3 jedec imx53
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53IEC Rev. 5, 12/2012 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1 Ordering Information


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    PDF IMX53IEC MCIMX53xC DDR2/LVDDR2-800, LPDDR2-800, DDR3-800 samsung eMMC 4.5 schema tv sony USB_OTG i.mx53 emmc spec samsung SAHA Camera Module CSI2 samsung EMMC user guide DDR3 jedec imx53

    iMX536

    Abstract: sahara lcd monitor circuit diagram free us10 sd diode samsung lpddr2 Mobile RAM Automotive Telematics On-board unit Platform emmc jedec mechanical standard Samsung board Board design guide eMMC emmc 4.5 spec samsung sony bullet camera sd 3.0 emmc 4.4
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53AEC Rev. 5, 12/2012 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1


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    PDF IMX53AEC MCIMX53xA MX53xA MX53xA) 1080i/p iMX536 sahara lcd monitor circuit diagram free us10 sd diode samsung lpddr2 Mobile RAM Automotive Telematics On-board unit Platform emmc jedec mechanical standard Samsung board Board design guide eMMC emmc 4.5 spec samsung sony bullet camera sd 3.0 emmc 4.4

    MPC5634M

    Abstract: MRF6VP11KH mw4ic2020nb S12XEQ512 MPC5516E MXC300-30 MPC5602P MSC7120 mpx6115 S08DZ128
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: ,


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    PDF DSP56311EVM DSP56311VF150 DSP56311VL150 DSP56321VF200 DSP56321VF220 DSP56321VF240 DSP56321VF275 DSP56321VL200 DSP56321VL220 DSP56321VL240 MPC5634M MRF6VP11KH mw4ic2020nb S12XEQ512 MPC5516E MXC300-30 MPC5602P MSC7120 mpx6115 S08DZ128

    SONY VTR M15 DIAGRAM

    Abstract: SAHA Freescale i.MX53 Quick Start Board "eMMC" Thermal Impedance sahara lcd monitor circuit diagram free samsung lpddr2 imx53 MCIMX537CVV8C emmc operation ver 4.41 samsung eMMC 4.5
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53IEC Rev. 4, 11/2011 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information


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    PDF IMX53IEC MCIMX53xC DDR2/LVDDR2-800, LPDDR2-800, DDR3-800 SONY VTR M15 DIAGRAM SAHA Freescale i.MX53 Quick Start Board "eMMC" Thermal Impedance sahara lcd monitor circuit diagram free samsung lpddr2 imx53 MCIMX537CVV8C emmc operation ver 4.41 samsung eMMC 4.5

    airbag crash sensor

    Abstract: MMA12xxEG MPC56X MPC56xx mc33902 mems transducer Accelerometer 800g airbag car airbag AN3111
    Text: Xtrinsic Accelerometers Xtrinsic MMA16xxW and MMA26xxW Airbag Sensors Inertial satellite sensors that support the DSI protocol Overview Automotive airbag systems continue to enhance passenger safety through the incorporation of increasingly sophisticated features. Automotive suppliers face continuing


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    PDF MMA16xxW MMA26xxW airbag crash sensor MMA12xxEG MPC56X MPC56xx mc33902 mems transducer Accelerometer 800g airbag car airbag AN3111

    SCIMX

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


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    PDF IMX53CEC MCIMX53xD MX53xD SCIMX

    HMI 14 PIN CONNECTOR CONFIGURATION

    Abstract: emmc jedec mechanical standard emmc bga 162 "thermal switch" t175
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 2, 5/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information


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    PDF IMX53AEC MCIMX53xA MX53xA MX53xA) 1080i/p HMI 14 PIN CONNECTOR CONFIGURATION emmc jedec mechanical standard emmc bga 162 "thermal switch" t175

    SCIMX538DZK1C

    Abstract: samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


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    PDF IMX53CEC MCIMX53xD MX53xD SCIMX538DZK1C samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI

    accelerometer airbag

    Abstract: AIRBAG EMULATION RESISTORS MMA6801QR2 LQFP64EP MC9S12XEG128MAA airbag sensor airbag PSI5 transceiver squib transistor 6b6
    Text: Freescale Semiconductor Reference Manual ARDRM Rev. 1.0, 5/2010 Airbag Reference Demonstrator Reference Manual by: Mark Jordan and Petr Fajmon Freescale Semiconductor, Inc., 2010. All rights reserved. Important Notice Freescale provides the enclosed product s under the following conditions:


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    emmc 5.0

    Abstract: iMX536 IC_USB voltage class "ARM Cortex A8" samsung ddr2 nand ESDHC MCIMX THERMAL Fuse m20 tf 115 c lpddr2 layout 15 TFT 20 pin lvds
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53AEC Rev. 6, 03/2013 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1


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    PDF IMX53AEC MCIMX53xA MX53xA MX53xA) 1080i/p emmc 5.0 iMX536 IC_USB voltage class "ARM Cortex A8" samsung ddr2 nand ESDHC MCIMX THERMAL Fuse m20 tf 115 c lpddr2 layout 15 TFT 20 pin lvds

    samsung EMMC user guide

    Abstract: eMMC 4.4 Jedec lpddr2 emmc 4.4 standard jedec ARM cortex A9 neon SIMD imx53 Freescale i.MX53 Quick Start Board H.264 encoder cortex a8 schema tv sony SAMSUNG NAND FLASH TRANSLATION LAYER SOFTWARE
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53IEC Rev. 6, 03/2013 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1 Ordering Information


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    PDF IMX53IEC MCIMX53xC DDR2/LVDDR2-800, LPDDR2-800, DDR3-800 samsung EMMC user guide eMMC 4.4 Jedec lpddr2 emmc 4.4 standard jedec ARM cortex A9 neon SIMD imx53 Freescale i.MX53 Quick Start Board H.264 encoder cortex a8 schema tv sony SAMSUNG NAND FLASH TRANSLATION LAYER SOFTWARE

    axi interface ddr3 memory controller

    Abstract: sd 3.0 emmc 4.4 BT.1120 xtalosc emmc bga 162
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53IEC Rev. 3, 7/2011 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information


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    PDF IMX53IEC MCIMX53xC DDR2/LVDDR2-800, LPDDR2-800, DDR3-800 axi interface ddr3 memory controller sd 3.0 emmc 4.4 BT.1120 xtalosc emmc bga 162

    MCIMX535

    Abstract: MCIMX535DVV1C MCIMX535DVV IMX53CEC mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4, 11/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


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    PDF IMX53CEC MCIMX53xD MX53xD MCIMX535 MCIMX535DVV1C MCIMX535DVV mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout

    eMMC "thermal impedance"

    Abstract: PCIMX535DVV1C emmc Card connector 062N n78c 4.712 eMMC PoP emmc pcb layout 100KPD diode 4.7-16
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 2, 5/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm


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    PDF IMX53CEC MCIMX53xD MX53xD DDR2/LVDDR2-800, eMMC "thermal impedance" PCIMX535DVV1C emmc Card connector 062N n78c 4.712 eMMC PoP emmc pcb layout 100KPD diode 4.7-16

    MS08QD4

    Abstract: MCF52236 MPC56xx instruction set digrf MCF52252 MMM6000 MMM7010 MPC5602B MS08EL32 MPC56xx
    Text: SG1000mini Freescale Semiconductor Product Selector Guides Quarter 2, 2009 Product Selector Guide Cross-Reference, SG1000CR Automotive, SG187 Analog and Mixed Signal Power Management, SG1002 Digital Signal Processors DSP , SG1004 Network/Embedded Processors, SG1007


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    PDF SG1000mini SG1000CR SG187 SG1002 SG1004 SG1007 SG1009 SG1010 SG1013 32-Bit MS08QD4 MCF52236 MPC56xx instruction set digrf MCF52252 MMM6000 MMM7010 MPC5602B MS08EL32 MPC56xx

    airbag sensor using CAN PROTOCOL

    Abstract: airbag car airbag engine ecu program MPC56xxx MC9S08SG squib driver Automotive ECU IC airbag crash sensor MPC56xx
    Text: Analog, Microcontrollers, Sensors Airbag Systems Automotive safety systems Overview Automotive airbag systems continue to enhance passenger safety through the incorporation of increasingly sophisticated features. Automotive suppliers face continuing pressure from the market to improve


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    PDF MC33793 airbag sensor using CAN PROTOCOL airbag car airbag engine ecu program MPC56xxx MC9S08SG squib driver Automotive ECU IC airbag crash sensor MPC56xx