LQFP176 Search Results

LQFP176

Abstract: LQFP-176 20X20
Contextual Info: SANYO Semiconductor Low Profile Quad Flat Package 176Pin Plastic LQFP176 20X20 Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

LQFP176-P-2424

Abstract: CI 2410
Contextual Info: LQFP176-P-2424-0.50C U nit : mm LQFP176-P-2424-0.50C !"! !" !?!"+'!"+ ! !")'!" ! !"E?! !"!"! !"!"! !"!?! U nit : mm

LQFP176

Abstract: LQFP-176 20X20
Contextual Info: SANYO Semiconductor Low Profile Quad Flat Package 176Pin Plastic LQFP176 20X20 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

MN6747

Abstract: AN13310 LQFP176 thermal LQFP176-P-2424 MN673747 MN673747HL 2424B
Contextual Info: Part No. MN673747 MN673747HL Package Code No. MLGA239-C-1111 LQFP176-P-2424B Publication date: December 2004 nt in ue Pl pl d in ea an c se ed lud pl vi an m m es si tf ed ain ai fo ol t n l ht low disc dis ena ten low tp in o co n an in :// g nt n ce c g

LQFP-176

Abstract: LQFP176
Contextual Info: Philips Semiconductors Package outlines LQFP176: plastic low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm 1998 Jan 21 149 SOT506-1

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP176 package SOT506-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

PLQP0176LB-A

Abstract: 1d132 FP-176A P-LQFP-176
Contextual Info: JEITA Package Code P-LQFP176-20x20-0.40 RENESAS Code PLQP0176LB-A Previous Code FP-176A/FP-176AV MASS[Typ.] 1.4g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 132 89 133 88 HE b1 Reference Symbol

LQFP176

Abstract: MS-026 LQFP-176 2615
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline LQFP176: plastic low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm SOT506-1 c y X A 132 133 89 88 ZE e E HE A 3 A A2 A1 θ wM Lp bp L detail X pin 1 index 45 176 44 1 ZD wM bp e v M A

TQPACK144SD

Abstract: POLYPOD-TQ144 Inca ETAS nexus 4 TQPACK176SD QFP-176
Contextual Info: SPC563M64CAL144/176 SPC563M64xx microcontroller family calibration and emulation system Data brief Features • Support for LQFP144 and LQFP176 MCU production packages allowing calibration systems to be built without requiring modifications to the standard production

LQFP176

Abstract: sot506 LQFP-176 24X24
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline LQFP176: plastic low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm SOT506-1 c y X A 132 133 89 88 ZE e E HE A 3 A A2 A1 θ wM Lp bp L detail X pin 1 index 45 176 1 44 ZD wM bp e v M A

LQFP176

Abstract: MS-026
Contextual Info: PDF: 2000 Feb 15 Philips Semiconductors Package outline LQFP176: plastic low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm SOT506-1 c y X A 132 133 89 88 ZE e E HE A 3 A A2 A1 θ wM Lp bp L detail X pin 1 index 45 176 44 1 ZD wM bp e v M A

AN5522

Abstract: AN5523 vertical AN5522 external LCD tv tuner CIRCUIT Diagram an-5523 an5265 AN5891 Tuner matsua MN101E11G AN5275
Contextual Info: DATA SHEET Part No. MN82832 Package Code No. LQFP176-P-2424B SEMICONDUCTOR COMPANY MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. Publication date: June 2006 SDB00105BEM 1 MN82832 MN82832 3-Dimension Y/C Separation LSI „ Overview MN82832 is a system LSI which incorporates processing necessary for high-quality televisions in a one

LQFP176-P-2424

Contextual Info: LQFP176-P-2424-0.50-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.87 TYP. 3/Nov. 28, 1996

AN5522

Abstract: AN5523 an5522 datasheet AN5891 AN5522 equivalent vertical AN5522 AN5265 an5275 an-5523 AN15931
Contextual Info: DATA SHEET Part No. MN82832 Package Code No. LQFP176-P-2424B SEMICONDUCTOR COMPANY MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. Publication date: December 2004 SDB00105AEM 1 MN82832 MN82832 3-Dimension Y/C Separation LSI Unit: mm „ Overview 132 89 133 24.00±0.10

Contextual Info: Package outline LQFP176: plastic low profile quad flat package; 176 leads; body 20 x 20 x 1.4 mm SOT1017-1 c y X A 89 132 133 ZE 88 e HE E w A A2 A3 A1 θ M bp Lp L pin 1 index 176 detail X 45 44 1 e w bp M ZD v M A v M B B D HD 5 10 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: Package outline LQFP176: plastic low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm SOT506-1 c y X A 132 133 89 88 ZE e E HE A 3 A A2 A1 θ wM Lp bp L detail X pin 1 index 45 176 1 44 ZD wM bp e v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

27Mhz ask demodulation

Abstract: MN6747
Contextual Info: DATA SHEET Part No. MN673747 MN673747HL Package Code No. MLGA239-C-1111 LQFP176-P-2424B SEMICONDUCTOR COMPANY MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. Publication date: December 2004 SDF00037AEM 1 MN673747, MN673747HL MN673747, MN673747HL Digital Conversion LSI

ZD MARK 22

Contextual Info: JEITA Package Code P-LQFP176-24x24-0.50 RENESAS Code PLQP0176KD-A Previous Code FP-176C/FP-176CV MASS[Typ.] 1.9g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 132 89 133 88 bp c c1 HE Reference

176P6Q

Abstract: P-LQFP176-24x24-0 P-LQFP-176
Contextual Info: JEITA Package Code P-LQFP176-24x24-0.50 RENESAS Code PLQP0176KB-A Previous Code MASS[Typ.] 176P6Q-A/FP-176E/FP-176EV 1.8g HD *1 D 132 89 133 88 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. bp

Contextual Info: JEITA Package Code P-LQFP176-20x20-0.40 RENESAS Code PLQP0176LA-A Previous Code 176P6R-A MASS[Typ.] 1.2g HD *1 D 132 89 133 88 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. bp E c *2 HE c1 b1 Reference

LQFP176-P-2424

Contextual Info: 176P6Q-A Plastic 176pin 24✕24mm body LQFP EIAJ Package Code LQFP176-P-2424-0.50 Weight g Lead Material Cu Alloy MD HD ME e JEDEC Code – b2 Under Development D 176 133 I2 1 132 Recommended Mount Pad 44 HE E Symbol 89 45 88 A L1 e b y A1 c A2 F L Detail F

Contextual Info: LQFP176-P-2424-0.50-BK Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ(≥5µm) 1.87 TYP. 3 版/96.11.28

PLQP0176KC-A

Abstract: ZD MARK 22
Contextual Info: JEITA Package Code P-LQFP176-24x24-0.50 RENESAS Code PLQP0176KC-A Previous Code FP-176/FP-176V MASS[Typ.] 1.9g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 132 89 133 88 bp c1 c HE Reference

MN673747HL

Contextual Info: M Di ain sc te on na tin nc ue e/ d ea s ht e v tp is :// it pa fo na llo so win ni g c. U co R .jp L a /s bo em u ic t la on te /e st -in in de for x. ma ht t m ion l . DATA SHEET MN673747 MN673747HL Package Code No. MLGA239-C-1111 LQFP176-P-2424B Pl Part No.