flash sharp
Abstract: No abstract text available
Text: PRODUCT SPECIFICATIONS Integrated Circuits Group LH28F008SCHT-L85 Flash Memory 8M 1MB x 8 (Model No.: LHF08CH5) Spec No.: EL104031B Issue Date: January 24, 2000 sharp sharp sharp sharp sharp sharp sharp sharp sharp sharp sharp sharp sharp sharp sharp
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LH28F008SCHT-L85
LHF08CH5)
EL104031B
flash sharp
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28F008SA
Abstract: E0000 LH28F008SCHT-L85
Text: PRELIMINARY PRODUCT SPECIFICATIONS Integrated Circuits Group LH28F008SCHT-L85 Flash Memory 8M 1M x 8 (Model No.: LHF08CH5) Issue Date: January 24, 2000 sharp LHF08CH5 ●Handle this document carefully for it contains material protected by international
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LH28F008SCHT-L85
LHF08CH5)
LHF08CH5
28F008SA
E0000
LH28F008SCHT-L85
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28F008SA
Abstract: E0000 LH28F008SCHT-L85
Text: Date 8M x8 Flash Memory LH28F008SCHT-L85 Jan. 24. 2000 LHF08CH5 ●Handle this document carefully for it contains material protected by international copyright law. Any reproduction, full or in part, of this material is prohibited without the express written permission of the company.
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LH28F008SCHT-L85
LHF08CH5
AP-001-SD-E
AP-006-PT-E
AP-007-SW-E
28F008SA
E0000
LH28F008SCHT-L85
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LH28F640BFHE-PBTLDY
Abstract: lh28f320s5hns-zp LH28F160S5T-L70A LH28F016 LH28F008SAT-ZW lh5116na-10 LH28F640BFHE-PBTL90 LH5164A-10L LH5164AN-80L lh5116-10
Text: Product Change Notice PCN : Lead (Pb)–free Packages October 15, 2004 This document updates PCN: ST-03-Z-06E issued January 23, 2004. Objective: Existing Memory ICs are changing from a lead (Pb) process to a lead-free process. Process Change Key Points 1) SHARP is changing the lead plating process from lead (Pb) to lead-free to meet the demands
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ST-03-Z-06E
connectiH5116D-10F
LH5116H-10F
LH5116NA-10F
LH5164A-10LF
LH5164AD-10LF
LH5164AHN-10LF
LH516AN0
LH28F640BFHE-PBTLDY
lh28f320s5hns-zp
LH28F160S5T-L70A
LH28F016
LH28F008SAT-ZW
lh5116na-10
LH28F640BFHE-PBTL90
LH5164A-10L
LH5164AN-80L
lh5116-10
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