Diodes Incorporated 17-33
Abstract: CKE 2009 cke02 RING TERM M6 2,5mm2
Text: PreLIMINARY Information L9D125G80BG4 2.5 Gb, DDR - SDRAM Integrated Module IMOD Benefits FEATURES DDR SDRAM Data Rate = 200, 250, 266, and 333 Mbps Package: • 25mm x 25mm, Encapsulated Plastic Ball Grid array (PBGA), 219 balls, 1.27mm pitch. 2.5V ±0.2V Core Power supply
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L9D125G80BG4
LDS-L9D125G80BG4-C
Diodes Incorporated 17-33
CKE 2009
cke02
RING TERM M6 2,5mm2
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Untitled
Abstract: No abstract text available
Text: PreLIMINARY Information L9D112G80BG4 1.2 Gb, DDR - SDRAM Integrated Module IMOD Benefits FEATURES DDR SDRAM Data Rate = 200, 250, 266, and 333 Mbps Package: • 25mm x 25mm, Encapsulated Laminate Ball Grid array (LBGA), 219 balls, 1.27mm pitch. 2.5V ±0.2V Core Power supply
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Original
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PDF
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L9D112G80BG4
LDS-L9D112G80BG4-A
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Diodes Incorporated 17-33
Abstract: T6N 700 DQ66 L9D12
Text: PreLIMINARY Information L9D112G80BG4 1.2 Gb, DDR - SDRAM Integrated Module IMOD Benefits FEATURES DDR SDRAM Data Rate = 200, 250, 266, and 333 Mbps Package: • 25mm x 25mm, Encapsulated Plastic Ball Grid array (PBGA), 219 balls, 1.27mm pitch. 2.5V ±0.2V Core Power supply
|
Original
|
PDF
|
L9D112G80BG4
LDS-L9D112G80BG4-C
Diodes Incorporated 17-33
T6N 700
DQ66
L9D12
|