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Infineon Technologies AG IRF6150 MOSFET 2P-CH 20V 7.9A 16FLIPFET
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	IRF6150	Reel			4,000	1 - 10 - 100 - 1000 - 10000 $1.2075	Buy Now

IRF6150 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
IRF6150		International Rectifier	HEXFET Power Mosfet		Original	PDF

IRF6150 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
9936 mosfet Abstract: G1 8645 Text: IRF6150 PROVISIONAL Bi-Directional MOSFET Outline Dimension NOTES : 1. ALL DIMENSIONS ARE SHOWN IN MILLIMET ERS [INCHES]. 2. CONTROLLING DIMENSION: [INCH]. 3.124 2X [.123] S1 S1 3. LET TER DES IGNAT ION: S2 S = SOURCE SK = SOURCE KELVIN G = GAT E IS = CURRENT SENSE	Original	IRF6150 9936 mosfet G1 8645	PDF
Bi-Directional P-Channel mosfet Abstract: HEXFET Power MOSFET P-Channel 20V P-Channel Power MOSFET IRF P CHANNEL MOSFET mosfet p channel irf IRF6150 Bi-Directional P-Channel HEXFET Power MOSFET HEXFET SO-8 MOSFET SO-8 Text: OBSOLETE PD - 93943 IRF6150 HEXFET Power MOSFET l l l l l Ultra Low RSS on per Footprint Area Low Thermal Resistance Bi-Directional P-Channel Switch Super Low Profile (<.8mm) Available Tested on Tape & Reel VSS -20V RSS(on) max IS 0.036Ω@VGS1,2 = -4.5V -7.9A	Original	IRF6150 Bi-Directional P-Channel mosfet HEXFET Power MOSFET P-Channel 20V P-Channel Power MOSFET IRF P CHANNEL MOSFET mosfet p channel irf IRF6150 Bi-Directional P-Channel HEXFET Power MOSFET HEXFET SO-8 MOSFET SO-8	PDF
IRF6150 Abstract: IR 30 S2 Text: PD - 93943 PROVISIONAL IRF6150 HEXFET Power MOSFET l l l l l Ultra Low RSS on per Footprint Area Low Thermal Resistance Bi-Directional P-Channel Switch Super Low Profile (<.8mm) Available Tested on Tape & Reel VSS -20V RSS(on) max IS 0.036Ω@VGS1,2 = -4.5V -7.9A	Original	IRF6150 IRF6150 IR 30 S2	PDF
PCB design for very fine pitch csp package Abstract: gold embrittlement joint IRF6100 IRF6150 with or without underfill process of mosfet Text: FlipFETTM MOSFET Design for High Volume SMT Assembly Hazel Schofield, Tim Sammon, Aram Arzumanyan, Dan Kinzer. International Rectifier Introduction & Summary International Rectifier has used a proprietary technique to position all the terminals of a HEXFET device on the same face of the die. This has enabled the development of wafer scale	Original	ISBN0-442-00260-2 ISPSD-99, PCB design for very fine pitch csp package gold embrittlement joint IRF6100 IRF6150 with or without underfill process of mosfet	PDF
220v AC voltage stabilizer schematic diagram Abstract: LG color tv Circuit Diagram tda 9370 1000w inverter PURE SINE WAVE schematic diagram schematic diagram atx Power supply 500w TV SHARP IC TDA 9381 PS circuit diagram wireless spy camera 9744 mini mainboard v1.2 sony 279-87 transistor E 13005-2 superpro lx Text: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 AD9272 Analog Front End, iMEMS Accelerometers & Gyroscopes . . . . . . 782, 2583 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-528 Acceleration and Pressure Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . Page 2585	Original	AD9272 P462-ND LNG295LFCP2U P463-ND LNG395MFTP5U 220v AC voltage stabilizer schematic diagram LG color tv Circuit Diagram tda 9370 1000w inverter PURE SINE WAVE schematic diagram schematic diagram atx Power supply 500w TV SHARP IC TDA 9381 PS circuit diagram wireless spy camera 9744 mini mainboard v1.2 sony 279-87 transistor E 13005-2 superpro lx	PDF
1N4733 Abstract: 1N914 DS2760 IRF6150 Text: Application Note 143 Multiple Battery Pack Applications Using The DS2760 www.maxim-ic.com INTRODUCTION One of the advantages of the DS27xx series of integrated Li-Ion protection products, and in particular the DS2760, is the capability to monitor and control battery power delivery within multi-battery systems.	Original	DS2760 DS27xx DS2760, DS2760 PD122100 PD122100 IRF6150 1683mils 1N4733 1N914 IRF6150	PDF
PCB design for very fine pitch csp package Abstract: IRF6100 IRF6150 Text: A New Generation of Wafer Level Packaged HEXFET  Devices by Tim Sammon, Hazel Schofield, Aram Arzumanyan, & Dan Kinzer, International Rectifier As presented at PCIM Europe 2000 Introduction & Summary International Rectifier has used a proprietary technique to position all the terminals of a HEXFET	Original	ISPSD-99, PCB design for very fine pitch csp package IRF6100 IRF6150	PDF
advantages of 1N4733 Abstract: 1N4733 1N914 DS2760 IRF6150 Text: Application Note 143 Multiple Battery Pack Applications Using The DS2760 www.maxim-ic.com INTRODUCTION One of the advantages of the DS27xx series of integrated Li-Ion protection products, and in particular the DS2760, is the capability to monitor and control battery power delivery within multi-battery systems.	Original	DS2760 DS27xx DS2760, DS2760 PD122100 PD122100 IRF6150 1683mils advantages of 1N4733 1N4733 1N914 IRF6150	PDF
CSP battery Abstract: DS2760 IRF6150 phone battery circuit Text: Chip Scale Packaging Technology Increases Cell Phone Talk Time Kenneth Dierberger International Rectifier Inc. El Segundo, CA Two main objectives in the design of a cell phone are minimizing size and maximizing talk/standby time. To achieve this the lithium-ion battery, with it’s high energy density	Original		PDF