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    Infineon Technologies AG IGC54T65T8RMX1SA2

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC54T65T8RMX1SA2)
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    Avnet Americas IGC54T65T8RMX1SA2 Waffle Pack 20 Weeks 4,347
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    fs100r07n2e4

    Abstract: No abstract text available
    Text: IGC54T65T8RM IGBT3 Chip Medium Power Features: • 650V Trench & Field Stop technology  high short circuit capability, self limiting short circuit current  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target


    Original     		PDF IGC54T65T8RM IEC62258ta L7582M, fs100r07n2e4

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    Abstract: No abstract text available
    Text: IGC54T65T8RM IGBT3 Chip Medium Power Features: • 650V Trench & Field Stop technology  high short circuit capability, self limiting short circuit current  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target


    Original     		PDF IGC54T65T8RM L7582M,