Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    IGC27T120T6L Search Results

    SF Impression Pixel

    IGC27T120T6L Price and Stock

    Infineon Technologies AG IGC27T120T6LX1SA3

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC27T120T6LX1SA3)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas IGC27T120T6LX1SA3 Waffle Pack 134
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    		Get Quote

    IGC27T120T6L Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    IGC27T120T6L Infineon Technologies IGBT Chips; Package: --; Technology: IGBT 4 Low Power; VDS (max): 1,200.0 V; IC (max): 25.0 A; VCE(sat) (max): 2.1 V; VGE(th) (min): 5.0 V; Original PDF

    IGC27T120T6L Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: IGC27T120T6L IGBT4 Low Power Chip FEATURES: • 1200V Trench + Field Stop technology • low switching losses • positive temperature coefficient • easy paralleling This chip is used for: • low / medium power modules C Applications: • low / medium power drives


    Original     		PDF IGC27T120T6L L7643C,

    Untitled

    Abstract: No abstract text available
    Text: IGC27T120T6L IGBT4 Low Power Chip FEATURES: • 1200V Trench + Field Stop technology • low switching losses • positive temperature coefficient • easy paralleling This chip is used for: • low / medium power modules C Applications: • low / medium power drives


    Original     		PDF IGC27T120T6L L7643C,

    Untitled

    Abstract: No abstract text available
    Text: IGC27T120T6L IGBT4 Low Power Chip FEATURES: • 1200V Trench + Field Stop technology • low switching losses • positive temperature coefficient • easy paralleling This chip is used for: • low / medium power modules C Applications: • low / medium power drives


    Original     		PDF IGC27T120T6L L7643C,