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    Infineon Technologies AG IGC10R60DEX1SA2

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC10R60DEX1SA2)
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    Avnet Americas IGC10R60DEX1SA2 Waffle Pack 251
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    IGC10R60DE

    Abstract: No abstract text available
    Text: IGC10R60DE TRENCHSTOPTM RC-Series for hard switching applications IGBT chip with monolithically integrated diode in packages offering space saving advantage Features: TM TRENCHSTOP Reverse Conducting RC technology for 600V applications offering: • Optimised VCEsat and VF for low conduction losses


    Original     		PDF IGC10R60DE 20kHz L7386B, IGC10R60DE