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    Infineon Technologies AG IGC109T120T8RMX1SA2

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC109T120T8RMX1SA)
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    Avnet Americas IGC109T120T8RMX1SA2 Waffle Pack 20 Weeks 2,016
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    IGC109T120T8RM

    Abstract: No abstract text available
    Text: IGC109T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench & Field stop technology  low switching losses  soft turn off  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target applications Chip Type


    Original     		PDF IGC109T120T8RM IGC109T120T8RM L7742U, L7742O,

    Untitled

    Abstract: No abstract text available
    Text: IGC109T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench & Field stop technology  low switching losses  soft turn off  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target applications Chip Type


    Original     		PDF IGC109T120T8RM IGC109T120T8RM L7742U, L7742O,

    Untitled

    Abstract: No abstract text available
    Text: IGC109T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench & Field stop technology  low switching losses  soft turn off  positive temperature coefficient  easy paralleling  Qualified according to JEDEC for target applications Chip Type


    Original     		PDF IGC109T120T8RM IGC109T120T8RM L7742U, L7742O,