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    Infineon Technologies AG IGC06R60DEX1SA1

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC06R60DEX1SA1)
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    Avnet Americas IGC06R60DEX1SA1 Waffle Pack 419
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    Abstract: No abstract text available
    Text: IGC06R60DE TRENCHSTOPTM RC-Series for hard switching applications IGBT chip with monolithically integrated diode in packages offering space saving advantage Features: TM TRENCHSTOP Reverse Conducting RC technology for 600V applications offering: • Optimised VCEsat and VF for low conduction losses


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