Untitled
Abstract: No abstract text available
Text: Bulletin I0118J rev. A 05/01 SC275.5. Series SCHOTTKY DIE 275 x 275 mils a 0.35 ± 0.01 14 ± 0.4 c NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). C b d D A Ø 40 (157) 3. DIMENSIONS AND TOLERANCES: a = 6.98 + 0, - 0.01
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Original
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I0118J
SC275.
S1025
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PDF
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Untitled
Abstract: No abstract text available
Text: Bulletin I0118J rev. C 09/03 SC275.5. Series 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) 3. LETTER DESIGNATION:
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Original
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I0118J
SC275.
S1025
SC275R015x5x
SC275S020x5x
SC275S030x5x
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PDF
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S1025
Abstract: sc275s045 s045x5x
Text: Bulletin I0118J rev. D 03/07 SC275.5. Series SCHOTTKY DIE 275 x 275 mils 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS)
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Original
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I0118J
SC275.
S1025
SC275R015x5x
SC275
S020x5x
SC275ability,
12-Mar-07
sc275s045
s045x5x
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PDF
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Untitled
Abstract: No abstract text available
Text: Bulletin I0118J rev. C 09/03 SC275.5. Series 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) 3. LETTER DESIGNATION:
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Original
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I0118J
SC275.
S1025
SC275R015x5x
SC275S020x5x
SC275S030x5x
SC275S045x5x
SC275S060x5x
SC275H045x5x
SC275H100x5x
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PDF
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sc275s045
Abstract: IRF 830 equivalent S1025
Text: Bulletin I0118J 07/00 SC275.5. Series SCHOTTKY DIE 275 x 275 mils a 0.35 ± 0.01 0.14 ± 0.0004 c b d D NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION: (INCH). C A Ø 40 (1.57) 3. DIMENSIONS AND TOLERANCES: a = 6.98 + 0, - 0.05
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Original
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I0118J
SC275.
S1025
sc275s045
IRF 830 equivalent
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PDF
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Untitled
Abstract: No abstract text available
Text: Bulletin I0118J rev. D 03/07 SC275.5. Series SCHOTTKY DIE 275 x 275 mils 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS)
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Original
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I0118J
SC275.
S1025
SC275R015x5x
SC275S020x5x
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PDF
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Untitled
Abstract: No abstract text available
Text: Bulletin I0118J rev. C 09/03 SC275.5. Series 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) 3. LETTER DESIGNATION:
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Original
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I0118J
SC275.
S1025
SC275R015x5x
SC275S020x5x
SC275S030x5x
SC275S045x5x
SC275S060x5x
SC275H045x5x
SC275H100x5x
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PDF
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