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    Abstract: No abstract text available
    Text: PD - 94616 HF75D060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR • Soft Reverse Recovery Benefits • • • • • Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation


    Original     		PDF 125mm HF75D060ACE IRGC75B60K

    IRGC75B60K

    Abstract: IRGC75B60 9381-8
    Text: PD - 94616 HF75D060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR • Soft Reverse Recovery Benefits • • • • • Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation


    Original     		PDF HF75D060ACE 125mm 12-Mar-07 IRGC75B60K IRGC75B60 9381-8