Untitled
Abstract: No abstract text available
Text: Preliminary Data Sheet PD-20201 01/01 FD100H06A5BT Fred Die in Wafer Form a 0.35 ± 0.01 0.014 ± 0.0004 c 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION (INCH): b C d NOTES: A 40 (1.57) Wafer flat alligned with side b of the die
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PD-20201
FD100H06A5BT
S1025
8ETH06
100x100
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FD100H06A5B
Abstract: FD100H06A5F 8ETH06 FD100H06A5P FD100H06A5R MIL-HDBK-263 S1025
Text: PD - 20201 rev.C FD100H06A5B FRED Die in Wafer Form z z 600V VF = 2.4 V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter
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FD100H06A5B
220nC
12-Mar-07
FD100H06A5B
FD100H06A5F
8ETH06
FD100H06A5P
FD100H06A5R
MIL-HDBK-263
S1025
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Untitled
Abstract: No abstract text available
Text: Preliminary Data Sheet PD-20531 11/00 FD100H06A5BT Fred Die in Wafer Form a 0.35 ± 0.01 0.014 ± 0.0004 c 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION (INCH): b C d NOTES: A 40 (1.57) Wafer flat alligned with side b of the die
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PD-20531
FD100H06A5BT
S1025
100x100
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semitec
Abstract: 8ETH06 S1025 FD100H06A5B Semitec S1025
Text: Preliminary Data Sheet PD-20175 01/01 FD100H06A5BT Fred Die in Wafer Form a 0.35 ± 0.01 0.014 ± 0.0004 c 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION (INCH): b C d NOTES: A 40 (1.57) Wafer flat alligned with side b of the die
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Original
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PD-20175
FD100H06A5BT
S1025
8ETH06
FD103
100x100
semitec
FD100H06A5B
Semitec S1025
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FD100H06A5B
Abstract: PD-20201 8ETH06 S1025
Text: Preliminary Data Sheet PD-20201 rev. A 06/01 FD100H06A5B Fred Die in Wafer Form a 0.35 ± 0.01 0.014 ± 0.0004 c 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION (INCH): b C d NOTES: A 40 (1.57) Wafer flat alligned with side b of the die
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Original
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PDF
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PD-20201
FD100H06A5B
S1025
8ETH06
100x100
FD100H06A5B
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