DIM300XCM45-F000
Abstract: No abstract text available
Text: DIM300XCM45-F000 IGBT Chopper Module DS5918- 1.3 February 2009 LN26586 FEATURES Soft Punch Through Silicon Isolated AlSiC Base with AlN Substrates High Thermal Cycling Capability KEY PARAMETERS V CES V CE(sat) * (typ) IC (max) I C(PK) (max) 4500V 2.9V 300A
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DIM300XCM45-F000
DS5918-
LN26586)
DIM300XCM45-F000
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DIM300XCM45-F000
Abstract: AAAD LN25740
Text: DIM300XCM45-F000 IGBT Chopper Module Provisional DS5918 1.1 November 2007 LN25740 FEATURES 10µs Short Circuit Withstand Soft Punch Through Silicon Lead Free construction KEY PARAMETERS V CES V CE(sat) * (typ) IC (max) I C(PK) (max) 4500V 2.9 V 300A 600A
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DIM300XCM45-F000
DS5918
LN25740)
DIM300XCM45-F000
AAAD
LN25740
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DIM300XCM45-F000
Abstract: 8888a
Text: DIM300XCM45-F000 IGBT Chopper Module Provisional DS5918 1.2 December 2007 LN25834 FEATURES 10µs Short Circuit Withstand Soft Punch Through Silicon Lead Free construction KEY PARAMETERS V CES V CE(sat) * (typ) IC (max) I C(PK) (max) 4500V 2.9 V 300A 600A
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DIM300XCM45-F000
DS5918
LN25834)
DIM300XCM45-F000
8888a
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