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    Microchip Technology Inc CDS5530B-1

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    Microchip Technology Inc CDS5530D-1

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    Microchip Technology Inc CDS5534B-1

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    Microchip Technology Inc CDS5535B-1

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    Microchip Technology Inc CDS5531DUR-1

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    DS553 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    DS55325 National Semiconductor Memory Drivers Original PDF

    DS553 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    DIM400DDM12-A000

    Abstract: DS5532-3
    Text: DIM400DDM12-A000 DIM400DDM12-A000 Dual Switch IGBT Module Replaces July 2002, version DS5532-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5532-3.0 March 2003


    Original     		PDF DIM400DDM12-A000 DS5532-2 DS5532-3 3300Varantee DIM400DDM12-A000

    DIM1600FSM12-A000

    Abstract: LIN26324
    Text: DIM1600FSM12-A000 Single Switch IGBT Module DS5533-3.1 August 2008 LIN26324 FEATURES 10µs Short Circuit Withstand Non Punch Through Silicon Isolated AlSiC Base with AIN Substrates Lead Free Construction High Thermal Cycling Capability KEY PARAMETERS VCES


    Original     		PDF DIM1600FSM12-A000 DS5533-3 LIN26324) DIM1600FSM12-A000 LIN26324

    DIM400DDM12-A000

    Abstract: No abstract text available
    Text: DIM400DDM12-A000 DIM400DDM12-A000 Dual Switch IGBT Module Preliminary Information DS5532-1.2 May 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates KEY PARAMETERS


    Original     		PDF DIM400DDM12-A000 DS5532-1 DIM400DDM12-A000

    Untitled

    Abstract: No abstract text available
    Text: DIM400LSS12-A000 DIM400LSS12-A000 Single Switch IGBT Module Replaces March 2003, version DS5534-3.0 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5534-4.0 July 2003 KEY PARAMETERS VCES typ VCE(sat)*


    Original     		PDF DIM400LSS12-A000 DS5534-3 FDS5534-4 DIM400LSS12-A000

    DIM800FSM12-A000

    Abstract: No abstract text available
    Text: DIM800FSM12-A000 Single Switch IGBT Module Replaces DS5531-3.1 DS5531-4 November 2010 LN27682 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)


    Original     		PDF DIM800FSM12-A000 DS5531-3 DS5531-4 LN27682) DIM800FSM12-A000

    lm 124 ic

    Abstract: ESM 310 DIM2400ESM12-A000
    Text: DIM2400ESM12-A000 Single Switch IGBT Module Replaces DS5536-3.0 DS5536-4 October 2010 LN27615 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)


    Original     		PDF DIM2400ESM12-A000 DS5536-3 DS5536-4 LN27615) lm 124 ic ESM 310 DIM2400ESM12-A000

    12v to 1000v inverters circuit diagrams

    Abstract: bi-directional switches IGBT DIM400LSS12-A000 6x55 diode IC LM 2003
    Text: DIM400LSS12-A000 DIM400LSS12-A000 Single Switch IGBT Module Replaces June 2002, version DS5534-2.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5534-3.0 March 2003 KEY PARAMETERS VCES typ VCE(sat)*


    Original     		PDF DIM400LSS12-A000 DS5534-2 DS5534-3 DIM400LSS12-A000 12v to 1000v inverters circuit diagrams bi-directional switches IGBT 6x55 diode IC LM 2003

    DIM2400ESM12-A000

    Abstract: No abstract text available
    Text: DIM2400ESM12-A000 DIM2400ESM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5536-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5529-3.0 March 2003


    Original     		PDF DIM2400ESM12-A000 DS5536-2 DS5529-3 33arantee DIM2400ESM12-A000

    DIM1600FSM12-A000

    Abstract: 6x transistor
    Text: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5533-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5533-3.0 March 2003


    Original     		PDF DIM1600FSM12-A000 DS5533-2 DS5533-3 DIM1600FSM12-A000 6x transistor

    DIM1600FSM12-A000

    Abstract: DIM1600FSM12-A
    Text: DIM1600FSM12-A000 Single Switch IGBT Module Replaces DS5533-4 DS5533-5 July 2014 LN31767 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)


    Original     		PDF DIM1600FSM12-A000 DS5533-4 DS5533-5 LN31767) DIM1600FSM12-A000 DIM1600FSM12-A

    DIM400DDM12-A000

    Abstract: DIM400DDM12-A
    Text: 6 3 Replaces DS5532-4 FEATURES ±0.2 • ±0.2 10µs Short Circuit Withstand 18 6 x O7 Dual Switch IGBT Module DS5532-5 June 2014 LN31690 14 ±0.2 11.5 ±0.2 DIM400DDM12-A000 KEY PARAMETERS 28 ±0.5  High44 Thermal ±0.2 Cycling Capability  Non Punch


    Original     		PDF DS5532-4 DS5532-5 LN31690) DIM400DDM12-A000 DIM400DDM12-A000 DIM400DDM12-A

    DIM2400ESM12-A000

    Abstract: DIM2400ESM12-A
    Text: DIM2400ESM12-A000 Single Switch IGBT Module Replaces DS5536-4 DS5536-5 August 2014 LN31869 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)


    Original     		PDF DIM2400ESM12-A000 DS5536-4 DS5536-5 LN31869) DIM2400ESM12-A000 DIM2400ESM12-A

    DIM400DDM12-A000

    Abstract: grease DS5532-4
    Text: 6 3 DS5532-4 November 2009 LN26754 14 ±0.2 ±0.2 Replaces DS5532-3.1 Dual Switch IGBT Module 11.5 DIM400DDM12-A000 FEATURES ±0.2 18 10µs Short Circuit Withstand ±0.2 6 x O7 KEY PARAMETERS 28 ±0.5 Non Punch Silicon ±0.2 57 Through VCES VCE(sat) * (typ)


    Original     		PDF DS5532-4 LN26754) DS5532-3 DIM400DDM12-A000 DIM400DDM12-A000 grease

    DIM1600FSM12-A000

    Abstract: No abstract text available
    Text: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Preliminary Information DS5533-1.2 May 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates


    Original     		PDF DIM1600FSM12-A000 DS5533-1 DIM1600FSM12-A000

    2 way video splitter circuit diagram

    Abstract: TV 2 way splitter, circuit diagram PHILIPS TV tuner block TV 3 way splitter, circuit diagram 2 way rf splitter circuit diagram video balun schematic f type connectors log tx2 tv schematic diagram PHILIPS zarlink modem
    Text: SL2150F Front End Power Splitter with AGC Data Sheet DS5535 Features • • • • • • Single chip quadruple power splitter primary channel, secondary channel, OOB channel and loop through Wide dynamic range on all channels Independent AGC facility incorporated into all


    Original     		PDF SL2150F DS5535 -62dBc SL2150F/KG/LH2S SL2150F/KG/LH2T SL2150F 2 way video splitter circuit diagram TV 2 way splitter, circuit diagram PHILIPS TV tuner block TV 3 way splitter, circuit diagram 2 way rf splitter circuit diagram video balun schematic f type connectors log tx2 tv schematic diagram PHILIPS zarlink modem

    DIM800FSM12-A000

    Abstract: No abstract text available
    Text: DIM800FSM12-A000 DIM800FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5531-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5531-3.0 March 2003


    Original     		PDF DIM800FSM12-A000 DS5531-2 DS5531-3 DIM800FSM12-A000

    DIM1600FSM12-A000

    Abstract: No abstract text available
    Text: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5533-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5533-3.0 March 2003


    Original     		PDF DIM1600FSM12-A000 DS5533-2 DS5533-3 DIM1600FSM12-A000

    LVCMOS33

    Abstract: XA2C64A AEC-Q100 LVCMOS15 LVCMOS25 XAPP427 XA2C64A-8VQG44Q
    Text: XA2C64A CoolRunner-II Automotive CPLD R DS553 v1.1 May 5, 2007 Features • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade • Guaranteed to meet full electrical specifications over TA = -40° C to +105° C with TJ Maximum = +125° C


    Original     		PDF XA2C64A DS553 AEC-Q100 44-pin 100-pin XAPP375: XAPP376: XAPP378: XAPP382: XAPP389: LVCMOS33 LVCMOS15 LVCMOS25 XAPP427 XA2C64A-8VQG44Q

    LOG TX2 1044

    Abstract: ctb 43
    Text: SL2150F Front End Power Splitter with AGC Data Sheet DS5535 Features • • • • • • Single chip quadruple power splitter primary channel, secondary channel, OOB channel and loop through Wide dynamic range on all channels Independent AGC facility incorporated into all


    Original     		PDF SL2150F DS5535 -62dBc SL2150F/KG/LH2S SL2150F/KG/LH2T SL2150F LOG TX2 1044 ctb 43

    DIM1600FSM12-A000

    Abstract: No abstract text available
    Text: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5533-1.2 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates


    Original     		PDF DIM1600FSM12-A000 DS5533-1 DS5533-2 DIM1600FSM12-A000

    DIM200MHS12-A000

    Abstract: No abstract text available
    Text: DIM200MHS12-A000 DIM200MHS12-A000 Half Bridge IGBT Module Preliminary Information Replaces issue May 2002, version DS5535-1.4 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5535-2.1 June 2002 KEY PARAMETERS


    Original     		PDF DIM200MHS12-A000 DS5535-1 DS5535-2 DIM200MHS12-A000

    DIM2400ESM12-A000

    Abstract: No abstract text available
    Text: DIM2400ESM12-A000 DIM2400ESM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5536-1.3 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates


    Original     		PDF DIM2400ESM12-A000 DS5536-1 DS5529-2 DIM2400ESM12-A000

    Untitled

    Abstract: No abstract text available
    Text: DIM400DDM12-A000 Dual Switch IGBT Module Replaces DS5532-3.1 FEATURES 10µs Short Circuit Withstand High Thermal Cycling Capability Non Punch Through Silicon Isolated AlSiC Base with AlN Substrates DS5532-4 November 2009 LN26754 KEY PARAMETERS VCES VCE(sat) * (typ)


    Original     		PDF DIM400DDM12-A000 DS5532-3 DS5532-4 LN26754)

    vqg44

    Abstract: No abstract text available
    Text: XA2C64A CoolRunner-II Automotive CPLD R DS553 v1.0 October 31, 2006 Features • • • • • • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade Guaranteed to meet full electrical specifications over


    Original     		PDF XA2C64A DS553 AEC-Q100 44-pin XAPP784: XAPP375: XAPP376: XAPP378: XAPP382: XAPP389: vqg44