8132
Abstract: passivation DS5003
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: July 11, 1994 To: Subject: PRODUCT CHANGE NOTICE – F42101 Description: DS500X/DS53XX Passivation Change The DS500X and DS53XX products (DS5001, DS5002, DS5003, DS5004, DS5311, DS5340) will undergo a change in passivation from the current single layer 10 KA Hotwall OXIDE passivation to a 10
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F42101
DS500X/DS53XX
DS500X
DS53XX
DS5001,
DS5002,
DS5003,
DS5004,
DS5311,
DS5340)
8132
passivation
DS5003
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CARSEM
Abstract: DS500X
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: August 19, 1995 Subject: PRODUCT CHANGE NOTICE – G51901 Description: Additional Assembly Site for DS500X and DS53XX Devices Description of Change: The DS500X and DS53XX families of microprocessors will have an additional second source subcontractor assembly site added for 80 pin QFP plastic package types. The additional assembly site is Carsem, located in Malaysia. Once this additional capacity is qualified and is on–line, Dallas Semiconductor will ship product assembled at either site interchangeably.
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G51901
DS500X
DS53XX
CARSEM
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SOFTENER
Abstract: DS63 DS5311FP INTEL END OF LIFE 80C196 register file DS5396FP HD6303 nec v40
Text: D S63« P R O D U C T P R E V IE W DALLAS . DS53xx Micro Softener Chips s e m ic o n d u c to r FEATURES PIN DESCRIPTION • Chips provide softness for microprocessor or microcontroller-based systems • Adapts to task-at-hand: -Converts CMOS SRAM into lithium-backed
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DS53xx
DS5340
DS5303
DS2340
DS2301
SOFTENER
DS63
DS5311FP
INTEL END OF LIFE 80C196
register file
DS5396FP
HD6303
nec v40
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register file
Abstract: INTEL END OF LIFE 80C196 80C196 BOOT HD6301
Text: DS53xx PRODUCT PREVIEW DALLAS SEMICONDUCTOR FEATURES DS53xx Micro Softener Chips PIN DESCRIPTION • Chips provide softness for microprocessor or microcontroller-based systems • Adapts to task-at-hand: -Converts CMOS SRAM into lithium-backed NV program/data storage
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DS53xx
-DS5340FP:
DS5340
DS5303
DS2340
DS2301
06149Q
register file
INTEL END OF LIFE 80C196
80C196 BOOT
HD6301
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CE5C
Abstract: CEA 243 A12C A14C ZZ1A18 6803 microprocessor pcetc
Text: DALLAS SEMICONDUCTOR CORP BTE D m 2 b l 4] i 3D Q0033t>E S 1 3 DAL 0S5340 n~'5Z-!>V 0.5 DS5340 V40 Softener Chip DJy.!LAS SEMICONDUCTOR FEATURES PIN DESCRIPTION • Provides softness for V40-based systems • Adapts to task-at-hand: -Converts up to 672K bytes of CMOS
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Q0033t
13DAL
0S5340
DS5340
V40-based
A10CZÃ
20000H
G0000H
80000H
E000CH
CE5C
CEA 243
A12C
A14C
ZZ1A18
6803 microprocessor
pcetc
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HD63701
Abstract: instruction set HITACHI HD6301 HD6303 HD6303Y DS1283 DS2301V DS2301Y HD63701Y 2650 cpu hd63701y0
Text: DALLAS SEMICONDUCTOR CORP S2E D 2 L .1 4 1 3 0 OQG hTSa 4D3 «D A L DS2301 PRODUCT PREVIEW DS2301 DALLAS SEMICONDUCTOR FEATURES Soft 6301 Stik PACKAGE OUTLINE • 630x subsystems adapt to task-at-hand: -Up to 64K bytes of NV SRAM for program/data -Serial bootstrap loading of software
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DS2301
HD6303Y
16-bit
-DS2301V:
-DS2301Y:
-DS2301V
40-pos.
HD6301V
-DS2301Y
HD63701
instruction set HITACHI HD6301
HD6303
DS1283
DS2301V
DS2301Y
HD63701Y
2650 cpu
hd63701y0
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Untitled
Abstract: No abstract text available
Text: DS5303 PRODUCT PREVIEW DALLAS DS5303 6303 Softener Chip s e m ic o n d u c t o r FEATURES PACKAGE OUTLINE • Provides softness for HD6303-based systems: •iinnnnnnnnnnnnnnn r 80 79 n 77 76 7S 74 73 72 71 70 6» 66 67 66 <6 > 64 — IWJ7PUT 1 2 63 I D VCCI
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DS5303
HD6303-based
CRC-16
DS5303
DS5303FP
80-pin
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32E32
Abstract: 3MD12
Text: DS5311FP P R E L IM IN A R Y PALLAS DS5311FP 68HC11 Softener Chip s e m ic o n d u c to r FEATURES • Softens 68HC11 -based systems - Converts up to 64K bytes of CMOS RAM into lithium-backed NV program/data storage - Serial bootstrap loading - In-system program changes adapt HC11 to task
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DS5311FP
68HC11
32E32
3MD12
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8086 assembly language for serial port
Abstract: 8086 hex code IBM POWER3 processor
Text: DS5340FP DALLAS S E M IC O N D U C T O R FEATURES DS5340FP V40 Softener Chip PIN DESCRIPTION • Provides softness for V40-based systems • Adapts to task-at-hand: - Converts up to 672K bytes of CMOS SRAM into lithium-backed NV program/data storage - Serial bootstrap loading for in-system
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DS5340FP
V40-based
DS5340FP
8086 assembly language for serial port
8086 hex code
IBM POWER3 processor
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Untitled
Abstract: No abstract text available
Text: DS5340 PRODUCT PREVIEW DALLAS S EM IC O N D U C T O R DS5340 V40 Softener Chip FEATURES PIN DESCRIPTION • Provides softness for V40-based systems • Adapts to task-at-hand: -Converts up to 672K bytes of CMOS SRAM into lithium-backed NV program/data storage
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DS5340
V40-based
FFF40H
DSW40
XFF40H
F8000H
32KRAMs
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nec v40
Abstract: A13D
Text: DS5340FP FULL DATA SHEET AV A ILA B LE — C A LL 214-450-3836 M I I - iL Q DS5340FP V40 Softener Chip SEMICONDUCTOR FEATURES PIN DESCRIPTION o • Provides softness for V40-based systems: N o ^ in s < < < < < < < < Q .Q .IL L 1 Q .Q .IL • Adapts to task-at-hand:
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DS5340FP
V40-based
DS2340
72-pin
DS5340
DS5340.
nec v40
A13D
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DS2311
Abstract: No abstract text available
Text: JUN li 1993 DS5311FP P R E L IM IN A R Y PALLAS DS5311FP 68HC11 Softener Chip s e m ic o n d u c to r FEATURES • Softens 68HC11 -based systems - Converts up to 64K bytes of CMOS RAM into lithium-backed NV program/data storage - Serial bootstrap loading - In-system program changes adapt HC11 to task
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DS5311FP
68HC11
03736C
DS2311
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65A3
Abstract: 8086 instruction set 72 PC RAM nec v40 QS5340 60A8 "65a3" 8086 Parallel Ports DS1283 DS2340T
Text: DAL LAS SEMI CONDUCTOR CORP 3TE 2bl4130 D 0 00 3 20 b 4 DAL DS2340 P UI.UIJ I . 23S3SS D A L L A yWf LIM." -4 ,-t, I. * . '. DS2340 Soft V40 Flip Stik S SEMICONDUCTOR -*• JU M FEATURES PACKAGE OUTLINE • V40-based embedded control system adapts to task-at-hand:
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Sbl4130
0003EÃ
DS2340
V40-based
DS2340T
DS2340
256-B
DS2340.
65A3
8086 instruction set
72 PC RAM
nec v40
QS5340
60A8
"65a3"
8086 Parallel Ports
DS1283
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Hitachi 32k static RAM
Abstract: HD6303 Motorola 6303 6665 RAM DSB303 motorola 6803 microprocessor HITACHI hd6303 h06303 A10C A12C
Text: DA L L A S S E M I C O N D U C T O R CORP 3TE D Q0033S7 1 DAL DS5303 Jjgjg ^ ö s z a n iü is a D Ä LLÄ 3 SEMICONDUCTOR ¿• S r# 2tmi30 'T - S Z - W O S DS5303 6303 Softener Chip 'Ulfpip 'I' J. iri-iV-V ' • g~Éf> 1 àÉÉ«f rrfPf-fih •''~~ "‘
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2bl4130
Q0033S7
DS5303
HB12iâ
DS5303
HD6303-based
CRC-16
Hitachi 32k static RAM
HD6303
Motorola 6303
6665 RAM
DSB303
motorola 6803 microprocessor
HITACHI hd6303
h06303
A10C
A12C
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PJ73
Abstract: PJ 73 instruction set HITACHI HD6301 HD63701 PK73 DS2301V-08 HD6303Y DS1283 DS2301V DS2301Y
Text: DALLAS SEMICONDUCTOR CORP BTE D m 5 b l4 1 3 0 00 03 2 7 7 3 E3 DAL DS2301 nilHMvrnjffiaaaaffti’i- PRODUCT PREVIEW I DS2301 Soft 6301 Stik T ^ -W -o S Eft^OMDUCTCm FEATURES PACKAGE OUTLINE • 630x subsystems adapt to task-at-hand: -Up to 64K bytes of NV SRAM for
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2bl413Q
DS2301
HD6303V
16-bit
DS2301V
DS2301
PJ73
PJ 73
instruction set HITACHI HD6301
HD63701
PK73
DS2301V-08
HD6303Y
DS1283
DS2301Y
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53a15
Abstract: 8086 microprocessor pin description DS1283 DS2340 DS2340T 8086 instruction set nec v40 ibr 273
Text: DALLAS SEMICONDUCTOR CORP SEE D • 2bl4130 OOObTMB 5b4 ■ DAL PRO DUCT PREVIEW DALLAS SEMICONDUCTOR DS2340 Soft V40 Flip Stik - 0 7 FEATURES PACKAGE OUTLINE • V40-based embedded control system adapts to task-at-hand: -Up to 256K bytes of lithium-backed NV
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DS2340
V40-based
DS2340T
DS1283
72-pin
DS5340
2bl4130
0S2340
DS2340
53a15
8086 microprocessor pin description
8086 instruction set
nec v40
ibr 273
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Untitled
Abstract: No abstract text available
Text: DS5340 PRODUCT PREVIEW DALLAS DS5340 V40 Softener Chip s e m ic o n d u c to r FEATURES PIN DESCRIPTION o«-cg<n^Lrtipr«. • Provides softness for V40-based systems: <<<<<<<< LO.Q.Q.Q.(LCLQ. • Adapts to task-at-hand: - Converts up to 672K bytes of CMOS
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DS5340
V40-based
DS5340
DS5340FP
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68hc11a
Abstract: No abstract text available
Text: JU N i l 1993 DS5311FP PRELIM INARY PALLAS DS5311FP 68HC11 Softener Chip s e m ic o n d u c to r FEATURES • Softens 68HC11-based systems - Converts up to 64K bytes of CMOS RAM into lithium-backed NV program/data storage - Serial bootstrap loading - In-system program changes adapt HC11 to task
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DS5311FP
68HC11
68HC11-based
68hc11a
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hc11
Abstract: simm 68hc11 ds5311fp
Text: DS5311FP FULL DATA SHEET AVAILABLE - CALL 214-450-3836 DALLAS SEMICONDUCTOR DS5311FP 68HC 11 S oftener Chip PACKAGE OUTLINE FEATURES • Softens 68HC11 -based systems - Converts up to 64K bytes of CMOS RAM into lithium-backed NV prograrrtfdata storage - Serial bootstrap loading
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DS5311FP
68HC11
DS2311
72-pin
DS5311FPHC11
DS5311.
hc11
simm 68hc11
ds5311fp
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