ds1200 y

Contextual Info: DS1200 Serial RAM Chip www.maxim-ic.com FEATURES § § § § § § PIN ASSIGNMENT 1024 Bits of Read/Write Memory Low Data Retention Current for Battery Backup Applications Four Million Bits/Second Data Rate Single-Byte or Multiple-Byte Data Transfer Capability

DS1200

Contextual Info: DS1200 Serial RAM Chip www.maxim-ic.com FEATURES § § § § § § PIN ASSIGNMENT 1024 Bits of Read/Write Memory Low Data Retention Current for Battery Backup Applications Four Million Bits/Second Data Rate Single-Byte or Multiple-Byte Data Transfer Capability

Contextual Info: Embedded Power for Business-Critical Continuity Rev. 09.26.13 DS1200HE 1 of 9 DS1200HE 1200 Watts Distributed Power System Front-end Bulk Power Total Output Power: 180 to 264Vac: 1200W continuous 90 to 140Vac: 1000W/1200W1 continuous Electrical Specifications

DS1200

Contextual Info: DS1200 Serial RAM Chip www.maxim-ic.com FEATURES § § § § § § PIN ASSIGNMENT 1024 bits of read/write memory Low data retention current for battery backup applications Four million bits/second data rate Single-byte or multiple-byte data transfer capability

DS1200

Contextual Info: DS1200 Serial RAM Chip www.maxim-ic.com FEATURES § § § § § § PIN ASSIGNMENT 1024 bits of read/write memory Low data retention current for battery backup applications Four million bits/second data rate Single-byte or multiple-byte data transfer capability

astec psu

Abstract: DS1200
Contextual Info: Embedded Power for Business-Critical Continuity Rev. 04.06.10_22 DS1200 1 of 4 DS1200 1200 Watts Distributed Power System Distributed Power Bulk Front-End Total Output Power: 1200 Watts +3.3 Vdc Stand-by Output Wide Range Input Voltage: 90 - 264 Vac Electrical Specifications

Contextual Info: DALLAS SEMICONDUCTOR DS1200 Serial RAM Chip FEATURES PIN ASSIGNMENT • 1024 bits of read/write memory • Low data retention current for battery backup applica­ tions Vcc[ 1 10 3 NC R S Ì 2 9 D NC 3 8 3 GND dq[ • 4 million bits/second data rate c lkE

51721-10002406AA

Abstract: DS1200 distributed control system of power plant Molex 87667 Molex 87667-7002 51761-10002406AALF
Contextual Info: Embedded Power for Business-Critical Continuity Rev. 9.10.09_22 DS1200  of 4 DS1200 1200 Watts Distributed Power System Distributed Power Bulk Front-End Total Output Power: 1200 Watts +3.3 Vdc Stand-by Output Wide Range Input Voltage: 90 - 264 Vac Electrical Specifications

ps_kill

Abstract: DS1200DC-3-004 SD-87667 DS1200DC-3 Molex 87667 Molex 87667-7002
Contextual Info: Embedded Power for Business-Critical Continuity Rev. 04.26.12_18 DS1200DC 1 of 4 DS1200DC 1200 Watts Distributed Power System Distributed Power Bulk Front-End Total Output Power: 1200 Watts 3.3 or 5.0 Vdc Stand-by Output Telco Input Range: -40 to -72 Vdc Electrical Specifications

DS1200

Contextual Info: DS1200 Serial RAM Chip www.maxim-ic.com FEATURES § § § § § § PIN ASSIGNMENT 1024 Bits of Read/Write Memory Low Data Retention Current for Battery Backup Applications Four Million Bits/Second Data Rate Single-Byte or Multiple-Byte Data Transfer Capability

Contextual Info: Embedded Power for Business-Critical Continuity Rev. 02.17.11_18 DS1200DC 1 of 4 DS1200DC 1200 Watts Distributed Power System Distributed Power Bulk Front-End Total Output Power: 1200 Watts 3.3 or 5.0 Vdc Stand-by Output Telco Input Range: -40 to -72 Vdc Electrical Specifications

Contextual Info: DS1200 Serial RAM Chip www.maxim-ic.com FEATURES § § § § § § PIN ASSIGNMENT 1024 Bits of Read/Write Memory Low Data Retention Current for Battery Backup Applications Four Million Bits/Second Data Rate Single-Byte or Multiple-Byte Data Transfer Capability

FCI 51721

Abstract: 51721-10002406 FCI Connector 87667-7002 51721-10002406AA Molex 87667-7002 51761-10002406AALF 51741-10002406CC astec psu 87667-7002 Molex 87667
Contextual Info: Embedded Power for Business-Critical Continuity Rev. 1.16.09_153 DS1200  of 4 DS1200 1200 Watts Distributed Power System Distributed Power Bulk Front-End Total Output Power: 1200 Watts +3.3 Vdc Stand-by Output Wide Range Input Voltage: 90 - 264 Vac Electrical Specifications

Contextual Info: DALLAS DS1200 Serial RAM Chip s e m ic o n d u c to r FEATURES PIN ASSIGNMENT • 1024 bits of read/write memory 1 < o o • Low data retention current for battery backup applica­ tions 10 3 NC R S l£ 2 dq[ • 4 million bits/second data rate c l k I- • Single byte or multiple byte data transfer capability

DIN 1445

Abstract: DS1201
Contextual Info: M ECH AN ICA L D R A W IN G S 8 - TO 28-PIN DIP 300 MIL Includes: DS1200 DS1259 DS2009D DS2010D DS2011D DS2013D PKG 8-PIN 10-PIN 14-PIN 16-PIN DIM MIN MAX MIN MAX MIN MAX MIN MAX AIN. MM 0.360 9.14 0.400 10.16 0.480 12.19 0.520 13.21 0.740 18.80 0.780 19.81

ps_kill

Abstract: DS1200 51741-10002406CC Molex 87667 Molex 87667-7002
Contextual Info: Embedded Power for Business-Critical Continuity Rev. 03.15.11_22 DS1200 1 of 4 DS1200 1200 Watts Distributed Power System Distributed Power Bulk Front-End Total Output Power: 1200 Watts +3.3 Vdc Stand-by Output Wide Range Input Voltage: 90 - 264 Vac Electrical Specifications

DS1201

Abstract: DS1200
Contextual Info: DS1200 DS1200 Serial RAM Chip FEATURES PIN ASSIGNMENT • 1024 bits of read/write memory • Low data retention current for battery backup applications • 4 million bits/second data rate VCC 1 10 NC RST 2 DQ CLK • Single byte or multiple byte data transfer capability

cen 496

Abstract: DS1868 DS1000H DS1205V DS1640
Contextual Info: M E C H A N IC A L D R A W IN G S 8 - TO 28-PIN DIP 300 MIL mr~ i r~ i i— i nn n n Includes: DS1000 DS1000M DS1003 DS1003M DS1004M DS1005 DS1005M DS1007 DS1010 DS1012M DS1013 DS1013M DS1020 DS1033M DS1035M DS1040M DS1044 DS1045 DS1200 DS1206 DS1210 PKG

2bl4130

Abstract: Cyber D81205 d863 DS1200 DS1204 DS1207 DS6301 DS6304 DS6305
Contextual Info: DALLAS SE MI CON DUCTOR CORP BSE D 2blM130 OOOBbMÔ IDAL 1 DS630x b u 'mitai C m DS630X CyberCard SEMICONDUCTOR - t » l - a i j p . j , . j ip ' B M P 'i » y T .S Z -v V ^ o 'TlStiiilÉiifiilif^fiirtirhilirtf • .-»1 FEATURES PACKAGE DESCRIPTION • Greater than 50,000 cycle connector life

DS1666

Abstract: DS2011D 74F04 DS1003 DS1003-16 DS1003-20 DS1003-25 DS1003-33 DS1003-40 DS1003M
Contextual Info: DS1003 DS1003 DALLAS SEMICONDUCTOR FEATURES 4-Tap Silicon Delay Line for RISC A pplications PIN ASSIGNMENT • All-silicon tim e delay IN • Four delayed clock phases from input NC • Input frequency independent NC NC • Precise tap-to-tap delays • Leading and trailing edge precision

marking kjd

Abstract: Marking KJD SOT23
Contextual Info: BAW56 DUAL SURFACE MOUNT SWITCHING DIODE POWER SEMICONDUCTOR Features • • • • Fast Switching Speed Surface Mount Package Ideally Suited for Automatic Insertion For General Purpose Switching Applications High Conductance SOT-23 A B Mechanical Data •

624C

Abstract: DS1204U DS1205S DS1228S DS1640
Contextual Info: DALLAS SEMICONDUCTOR DS1205S M ultiKey Chip FEATURES PIN ASSIGNMENT • T h re e s e c u re re a d /w rite d a ta p a rtitio n s o f 3 8 4 bits VCCI la s e r e tc h e d 15 3 14 m DQ o n 4 13 ~ n n GND 5 12 CLK QC 6 11 ~n~i d q o e MC Q j- 7 10 m GND m~ NC

1N4448W

Abstract: marking code K
Contextual Info: 1N4448W FAST SWITCHING SURFACE MOUNT DIODE Features • · · · Fast Switching Speed Surface Mount Package Ideally Suited for Automatic Insertion For General Purpose Switching Applications High Conductance E D A B Mechanical Data · · · · · SOD-123 Case: SOD-123, Molded Plastic

ds1285q

Abstract: DS1640
Contextual Info: D S 12 8 5 /D S 1285Q DALLAS SEMICONDUCTOR FEATURES D S 1285/D S 1285Q Real Tim e C lock PIN ASSIGNMENT • Drop-in replacem ent for IBM AT com puter clock/ca­ lendar • Pin configuration closely m atches M C146818A • Counts seconds, minutes, hours, day of the week,